Part Details for MX25L6406EXDI-12G by Macronix International Co Ltd
Overview of MX25L6406EXDI-12G by Macronix International Co Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MX25L6406EXDI-12G
MX25L6406EXDI-12G CAD Models
MX25L6406EXDI-12G Part Data Attributes:
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MX25L6406EXDI-12G
Macronix International Co Ltd
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Datasheet
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MX25L6406EXDI-12G
Macronix International Co Ltd
Flash, 32MX2, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-24
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | MACRONIX INTERNATIONAL CO LTD | |
| Package Description | TBGA, BGA24,5X5,40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Alternate Memory Width | 1 | |
| Clock Frequency-Max (fCLK) | 86 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3.3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.00002 A | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for MX25L6406EXDI-12G
This table gives cross-reference parts and alternative options found for MX25L6406EXDI-12G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MX25L6406EXDI-12G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| N25Q064A13E12A0E | Flash, 64MX1, PBGA24, 6 X 8 MM, ROHS COMPLIANT, PLASTIC, TBGA-24 | Micron Technology Inc | MX25L6406EXDI-12G vs N25Q064A13E12A0E |
| AT45DB641E-CCUN-T | Flash, 64MX1, PBGA9, UBGA-9 | Adesto Technologies Corporation | MX25L6406EXDI-12G vs AT45DB641E-CCUN-T |
| N25Q064A13E12A0G | Flash, 64MX1, PBGA24, 6 X 8 MM, ROHS COMPLIANT, PLASTIC, TBGA-24 | Micron Technology Inc | MX25L6406EXDI-12G vs N25Q064A13E12A0G |
| M25PX64-VZM6TP | EEPROM, 8MX8, Serial, CMOS, PBGA24, 6 X 8 MM, ROHS COMPLIANT, TBGA-24 | Numonyx Memory Solutions | MX25L6406EXDI-12G vs M25PX64-VZM6TP |
| S25FL064P0XBHI023 | Flash, 64MX1, PBGA24, BGA-24 | Cypress Semiconductor | MX25L6406EXDI-12G vs S25FL064P0XBHI023 |
| N25Q064A13E1241E | Flash, 64MX1, PBGA24, 6 X 8 MM, ROHS COMPLIANT, PLASTIC, TBGA-24 | Micron Technology Inc | MX25L6406EXDI-12G vs N25Q064A13E1241E |
| S25FL064P0XBHV020 | Flash, 64MX1, PBGA24, BGA-24 | Cypress Semiconductor | MX25L6406EXDI-12G vs S25FL064P0XBHV020 |
| S25FL064P0XBHV023 | Flash, 64MX1, PBGA24, 6 X 8 MM, 1 MM PITCH, HOLOGEN FREE, BGA-24 | Spansion | MX25L6406EXDI-12G vs S25FL064P0XBHV023 |
| S25FL064P0XBHI033 | Flash, 64MX1, PBGA24, BGA-24 | Cypress Semiconductor | MX25L6406EXDI-12G vs S25FL064P0XBHI033 |
| S25FL064P0XBHI030 | Flash, 64MX1, PBGA24, 6 X 8 MM, 1 MM PITCH, HOLOGEN FREE, BGA-24 | Spansion | MX25L6406EXDI-12G vs S25FL064P0XBHI030 |