Part Details for MVTX2601AG by Zarlink Semiconductor Inc
Overview of MVTX2601AG by Zarlink Semiconductor Inc
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Telecommunications
Part Details for MVTX2601AG
MVTX2601AG CAD Models
MVTX2601AG Part Data Attributes
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MVTX2601AG
Zarlink Semiconductor Inc
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Datasheet
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MVTX2601AG
Zarlink Semiconductor Inc
LAN Switching Circuit, CMOS, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ZARLINK SEMICONDUCTOR INC | |
Package Description | HBGA, BGA553(UNSPEC) | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B553 | |
JESD-609 Code | e0 | |
Length | 37.5 mm | |
Number of Functions | 1 | |
Number of Terminals | 553 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA553(UNSPEC) | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.46 mm | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Telecom IC Type | LAN SWITCHING CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 37.5 mm |