Datasheets
MVTX2601AG by:

LAN Switching Circuit, CMOS, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553

Part Details for MVTX2601AG by Zarlink Semiconductor Inc

Overview of MVTX2601AG by Zarlink Semiconductor Inc

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Applications Telecommunications

Part Details for MVTX2601AG

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MVTX2601AG Part Data Attributes

MVTX2601AG Zarlink Semiconductor Inc
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MVTX2601AG Zarlink Semiconductor Inc LAN Switching Circuit, CMOS, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC
Package Description HBGA, BGA553(UNSPEC)
Reach Compliance Code unknown
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B553
JESD-609 Code e0
Length 37.5 mm
Number of Functions 1
Number of Terminals 553
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA553(UNSPEC)
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 2.46 mm
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Telecom IC Type LAN SWITCHING CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 37.5 mm

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