Part Details for MT8LSDT1664HG-662 by Micron Technology Inc
Overview of MT8LSDT1664HG-662 by Micron Technology Inc
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for MT8LSDT1664HG-662
MT8LSDT1664HG-662 CAD Models
MT8LSDT1664HG-662 Part Data Attributes
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MT8LSDT1664HG-662
Micron Technology Inc
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Datasheet
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MT8LSDT1664HG-662
Micron Technology Inc
Synchronous DRAM Module, 16MX64, 7.5ns, CMOS, PDMA144,
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | DIMM, DIMM144,32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Date Of Intro | 1996-08-01 | |
| Access Time-Max | 7.5 ns | |
| Clock Frequency-Max (fCLK) | 100 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDMA-N144 | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | SYNCHRONOUS DRAM MODULE | |
| Memory Width | 64 | |
| Number of Terminals | 144 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 16MX64 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIMM | |
| Package Equivalence Code | DIMM144,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 4096 | |
| Standby Current-Max | 0.016 A | |
| Supply Current-Max | 1.6 mA | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | DUAL |