There are no models available for this part yet.
Overview of MT55L256L32PB-7.5 by Micron Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 3 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
CAD Models for MT55L256L32PB-7.5 by Micron Technology Inc
Part Data Attributes for MT55L256L32PB-7.5 by Micron Technology Inc
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
MICRON TECHNOLOGY INC
|
|
Part Package Code
|
BGA
|
|
Package Description
|
14 X 22 MM, PLASTIC, MS-028BHA, BGA-119
|
|
Pin Count
|
119
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
4.2 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PBGA-B119
|
|
JESD-609 Code
|
e0
|
|
Length
|
22 mm
|
|
Memory Density
|
8388608 bit
|
|
Memory IC Type
|
ZBT SRAM
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|
Memory Width
|
32
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
119
|
|
Number of Words
|
262144 words
|
|
Number of Words Code
|
256000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
256KX32
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Equivalence Code
|
BGA119,7X17,50
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
2.4 mm
|
|
Standby Current-Max
|
0.01 A
|
|
Standby Voltage-Min
|
3.14 V
|
|
Supply Current-Max
|
0.4 mA
|
|
Supply Voltage-Max (Vsup)
|
3.465 V
|
|
Supply Voltage-Min (Vsup)
|
3.135 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
14 mm
|
Alternate Parts for MT55L256L32PB-7.5
This table gives cross-reference parts and alternative options found for MT55L256L32PB-7.5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT55L256L32PB-7.5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS61NP25632-133BI | ZBT SRAM, 256KX32, 4.2ns, CMOS, PBGA119, PLASTIC, BGA-119 | Integrated Silicon Solution Inc | MT55L256L32PB-7.5 vs IS61NP25632-133BI |
| MT55L256L32PB-7.5 | ZBT SRAM, 256KX32, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119 | Cypress Semiconductor | MT55L256L32PB-7.5 vs MT55L256L32PB-7.5 |
| IS61NP25632-133B | ZBT SRAM, 256KX32, 4.2ns, CMOS, PBGA119, PLASTIC, BGA-119 | Integrated Silicon Solution Inc | MT55L256L32PB-7.5 vs IS61NP25632-133B |