Datasheets
MT47H32M16HR-25L:F by: Micron Technology Inc

DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 10 MM, ROHS COMPLIANT, FBGA-84

Part Details for MT47H32M16HR-25L:F by Micron Technology Inc

Overview of MT47H32M16HR-25L:F by Micron Technology Inc

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Part Details for MT47H32M16HR-25L:F

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MT47H32M16HR-25L:F Part Data Attributes

MT47H32M16HR-25L:F Micron Technology Inc
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MT47H32M16HR-25L:F Micron Technology Inc DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 10 MM, ROHS COMPLIANT, FBGA-84
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description TFBGA, BGA84,9X15,32
Pin Count 84
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.28
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.4 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B84
JESD-609 Code e1
Length 12.5 mm
Memory Density 536870912 bit
Memory IC Type DDR2 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 84
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 32MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA84,9X15,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 4,8
Standby Current-Max 0.007 A
Supply Current-Max 0.37 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 8 mm

Alternate Parts for MT47H32M16HR-25L:F

This table gives cross-reference parts and alternative options found for MT47H32M16HR-25L:F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT47H32M16HR-25L:F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MT47H32M16HW-25L:F DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16HW-25L:F
MT47H32M16HR-25E:F DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 10 MM, ROHS COMPLIANT, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16HR-25E:F
MT47H32M16HW-25EL:F DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16HW-25EL:F
MT47H32M16GC-25EL:B DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 12 X 12.50 MM, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16GC-25EL:B
MT47H32M16BN-25:D DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 10 X 12.50 MM, ROHS COMPLIANT, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16BN-25:D
MT47H32M16GC-25E:B DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 12 X 12.50 MM, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16GC-25E:B
MT47H32M16HR-25:F DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 10 MM, ROHS COMPLIANT, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16HR-25:F
MT47H32M16BN-25E:D DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 10 X 12.50 MM, ROHS COMPLIANT, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16BN-25E:D
MT47H32M16HW-25:F DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16HW-25:F
MT47H32M16FN-25E:D DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 10 X 12.50 MM, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16FN-25E:D
Part Number Description Manufacturer Compare
K4T51163QC-ZLE70 DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84 Samsung Semiconductor MT47H32M16HR-25L:F vs K4T51163QC-ZLE70
H5PS5162FFR-S6 DDR DRAM, 32MX16, 0.4ns, CMOS, PZMA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-84 SK Hynix Inc MT47H32M16HR-25L:F vs H5PS5162FFR-S6
H5PS5162FFR-S5L DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 SK Hynix Inc MT47H32M16HR-25L:F vs H5PS5162FFR-S5L
K4T51163QC-ZCF70 DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84 Samsung Semiconductor MT47H32M16HR-25L:F vs K4T51163QC-ZCF70
V59C1512164QCF25I DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, ROHS COMPLIANT, MO-207, FBGA-84 ProMOS Technologies Inc MT47H32M16HR-25L:F vs V59C1512164QCF25I
MT47H32M16CC-25EIT DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16CC-25EIT
MT47H32M16HW-25E:G DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16HW-25E:G
H5PS5162FFR-S5P DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 13 MM, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 SK Hynix Inc MT47H32M16HR-25L:F vs H5PS5162FFR-S5P
H5PS5162GFR-S5J DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 7.50 X 12.50 MM, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 SK Hynix Inc MT47H32M16HR-25L:F vs H5PS5162GFR-S5J
MT47H32M16HR-25LAT:F DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 10 MM, ROHS COMPLIANT, FBGA-84 Micron Technology Inc MT47H32M16HR-25L:F vs MT47H32M16HR-25LAT:F

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