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Memory DRAMs MT46V32M16P-75:C

Memory
MT46V32M16P-75:C
Micron Technology Inc
Description: DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66

Overview of MT46V32M16P-75:C by Micron Technology Inc

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Part Data Attributes for MT46V32M16P-75:C by Micron Technology Inc
Parametric Data

MT46V32M16P-75:C
Micron Technology Inc
Buy Now
-
-
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
Part Package Code
TSOP
Package Description
TSSOP, TSSOP66,.46
Pin Count
66
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
0.75 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8
JESD-30 Code
R-PDSO-G66
JESD-609 Code
e3
Length
22.22 mm
Memory Density
536870912 bit
Memory IC Type
DDR1 DRAM
Memory Width
16
Number of Functions
1
Number of Ports
1
Number of Terminals
66
Number of Words
33554432 words
Number of Words Code
32000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
32MX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Equivalence Code
TSSOP66,.46
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Refresh Cycles
8192
Seated Height-Max
1.2 mm
Self Refresh
YES
Sequential Burst Length
2,4,8
Standby Current-Max
0.005 A
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
DUAL
Width
10.16 mm
Want to compare parts?
  1. MT46V32M16P-75:C
    Micron Technology Inc
    DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66
    VS

Alternate Parts for MT46V32M16P-75:C

This table gives cross-reference parts and alternative options found for MT46V32M16P-75:C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT46V32M16P-75:C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
MT46V32M16TG-75E:C DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc MT46V32M16P-75:C vs MT46V32M16TG-75E:C
MT46V32M16P-75ZL DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc MT46V32M16P-75:C vs MT46V32M16P-75ZL
EDD5116AFTA-7B-E DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, ROHS COMPLIANT, PLASTIC, TSOP2-66 Elpida Memory Inc MT46V32M16P-75:C vs EDD5116AFTA-7B-E
K4H511638B-TCAA DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor MT46V32M16P-75:C vs K4H511638B-TCAA
K4H511638C-UCA20 DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor MT46V32M16P-75:C vs K4H511638C-UCA20
H5DU5162ETR-K2C DDR DRAM, 32MX16, 0.75ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 SK Hynix Inc MT46V32M16P-75:C vs H5DU5162ETR-K2C
MT46V32M16P-75E:F DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc MT46V32M16P-75:C vs MT46V32M16P-75E:F
MT46V32M16TG-75Z:C DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc MT46V32M16P-75:C vs MT46V32M16TG-75Z:C
K4H511638B-TLB0T DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66 Samsung Semiconductor MT46V32M16P-75:C vs K4H511638B-TLB0T
MT46V32M16TG-75Z DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc MT46V32M16P-75:C vs MT46V32M16TG-75Z
Part Number Description Manufacturer Compare
HYB25D512160BEL-6 DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 Qimonda AG MT46V32M16P-75:C vs HYB25D512160BEL-6
IS43R16320B-5TL DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66, ROHS COMPLIANT, PLASTIC, TSOP2-66 Integrated Silicon Solution Inc MT46V32M16P-75:C vs IS43R16320B-5TL
IS43R16320D-6TLI DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, TSOP2-66 Integrated Silicon Solution Inc MT46V32M16P-75:C vs IS43R16320D-6TLI
HY5DU121622BLT-L DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc MT46V32M16P-75:C vs HY5DU121622BLT-L
MT46V32M16TG-0:C DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc MT46V32M16P-75:C vs MT46V32M16TG-0:C
MT46V32M16TG-75LIT DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc MT46V32M16P-75:C vs MT46V32M16TG-75LIT
HY5DU121622BTP-H DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc MT46V32M16P-75:C vs HY5DU121622BTP-H
MT46V32M16TG-6T:FTR DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc MT46V32M16P-75:C vs MT46V32M16TG-6T:FTR
HY5DU121622DLT-L DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc MT46V32M16P-75:C vs HY5DU121622DLT-L
MT46V32M16TG-75E:C DDR DRAM, 32MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc MT46V32M16P-75:C vs MT46V32M16TG-75E:C

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