Datasheets
MT46V32M16BN-6L:D by: Micron Technology Inc

DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60

Part Details for MT46V32M16BN-6L:D by Micron Technology Inc

Overview of MT46V32M16BN-6L:D by Micron Technology Inc

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Available Datasheets

Part # Manufacturer Description Datasheet
DBL5W5P543A40LF Amphenol Communications Solutions D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 5W5 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Without Accessory on PCB.
DEL2V2P543H40LF Amphenol Communications Solutions D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 2V2 Pin Right Angle Solder 40A, Europe Standard, 500 Cycles, Front: Threaded Insert M3, Back: Harpoons for 2.4mm PCB Thickness.
DC8W8P500H30LF Amphenol Communications Solutions D-Sub Power Board Mount Connectors, Input Output Connectors, Full Power 8W8 Pin Right Angle Solder 30A, Europe Standard, 200 Cycles, Front: Without Accessory, Back: Harpoons for 2.4mm PCB Thickness.

Part Details for MT46V32M16BN-6L:D

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MT46V32M16BN-6L:D Part Data Attributes

MT46V32M16BN-6L:D Micron Technology Inc
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MT46V32M16BN-6L:D Micron Technology Inc DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description BGA, BGA60,9X12,40/32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.28
Access Time-Max 0.7 ns
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PBGA-B60
JESD-609 Code e3
Memory Density 536870912 bit
Memory IC Type DDR1 DRAM
Memory Width 16
Moisture Sensitivity Level 1
Number of Terminals 60
Number of Words 33554432 words
Number of Words Code 32000000
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA60,9X12,40/32
Package Shape RECTANGULAR
Package Style GRID ARRAY
Qualification Status Not Qualified
Refresh Cycles 8192
Sequential Burst Length 2,4,8
Standby Current-Max 0.005 A
Supply Current-Max 0.405 mA
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM

Alternate Parts for MT46V32M16BN-6L:D

This table gives cross-reference parts and alternative options found for MT46V32M16BN-6L:D. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT46V32M16BN-6L:D, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MT46V32M16FN-6L:F Micron Technology Inc Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 MT46V32M16BN-6L:D vs MT46V32M16FN-6L:F
K4H511638D-ZLB3 Samsung Semiconductor Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60 MT46V32M16BN-6L:D vs K4H511638D-ZLB3
K4H511638F-HCB3 Samsung Semiconductor Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, MT46V32M16BN-6L:D vs K4H511638F-HCB3
K4H511638J-BCB3T Samsung Semiconductor Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60 MT46V32M16BN-6L:D vs K4H511638J-BCB3T
K4H511638F-HCB30 Samsung Semiconductor Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 MT46V32M16BN-6L:D vs K4H511638F-HCB30
MT46V32M16BN-6:D Micron Technology Inc Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60 MT46V32M16BN-6L:D vs MT46V32M16BN-6:D
K4H511638J-BLB3T Samsung Semiconductor Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60 MT46V32M16BN-6L:D vs K4H511638J-BLB3T
MT46V32M16FN-6:D Micron Technology Inc Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60 MT46V32M16BN-6L:D vs MT46V32M16FN-6:D
K4H511638G-HLB3 Samsung Semiconductor Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60 MT46V32M16BN-6L:D vs K4H511638G-HLB3
K4H511638G-HLB30 Samsung Semiconductor Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60 MT46V32M16BN-6L:D vs K4H511638G-HLB30
Part Number Manufacturer Composite Price Description Compare
NT5DS32M16BF-6K Nanya Technology Corporation Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 0.80 X 1 MM PITCH, BGA-60 MT46V32M16BN-6L:D vs NT5DS32M16BF-6K
HY5DU121622DFP-KI SK Hynix Inc Check for Price DDR DRAM, 32MX16, 0.75ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 MT46V32M16BN-6L:D vs HY5DU121622DFP-KI
MT47H32M16CB-3ELIT:B Micron Technology Inc Check for Price DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA60, 12 X 10 MM, ROHS COMPLIANT, FBGA-60 MT46V32M16BN-6L:D vs MT47H32M16CB-3ELIT:B
MT46V32M16BN-75ZLIT Micron Technology Inc Check for Price DDR DRAM, 32MX16, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, LEAD FREE, PLASTIC, FBGA-60 MT46V32M16BN-6L:D vs MT46V32M16BN-75ZLIT
MT46H32M16LFBF-54AT:C Micron Technology Inc Check for Price DDR DRAM, 32MX16, 5ns, CMOS, PBGA60, 8 X 9 MM, GREEN, PLASTIC, VFBGA-60 MT46V32M16BN-6L:D vs MT46H32M16LFBF-54AT:C
MT46H32M16LGBF-75AT:C Micron Technology Inc Check for Price DDR DRAM, 32MX16, CMOS, PBGA60, 9 X 8 MM, GREEN, PLASTIC, VFBGA-60 MT46V32M16BN-6L:D vs MT46H32M16LGBF-75AT:C
H5DU5162EFR-E3J SK Hynix Inc Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 MT46V32M16BN-6L:D vs H5DU5162EFR-E3J
MT46V32M16FN-6TIT:F Micron Technology Inc Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 MT46V32M16BN-6L:D vs MT46V32M16FN-6TIT:F
MT46V32M16BN-75ELIT:C Micron Technology Inc Check for Price DDR DRAM, 32MX16, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, LEAD FREE, FBGA-60 MT46V32M16BN-6L:D vs MT46V32M16BN-75ELIT:C
V58C2512164SALJ4 ProMOS Technologies Inc Check for Price DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, GREEN, MO-207, FBGA-60 MT46V32M16BN-6L:D vs V58C2512164SALJ4

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