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Flash, 512MX1, PBGA24, TBGA-24
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
83AH2715
|
Newark | Flash Memory, 512Mbit, -40 To 85Deg C, Flash Memory Type:Serial Nor, Memory Configuration:64M X 8Bit, Interfaces:Spi, Ic Case/Package:Tbga, No. Of Pins:24Pins, Clock Frequency Max:133Mhz, Access Time:-, Supply Voltage Min:2.7V Rohs Compliant: Yes |Micron MT35XL512ABA1G12-0SIT RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 885 |
|
$6.2300 | Buy Now |
DISTI #
32AJ7524
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Newark | Flash Memory, 512Mbit, -40 To 85Deg C Rohs Compliant: Yes |Micron MT35XL512ABA1G12-0SIT RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$8.3700 / $11.2200 | Buy Now |
DISTI #
71250406
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Verical | NOR Flash Serial-SPI 3V/3.3V 512M-bit 512M/64M x 1/8-bit 24-Pin TBGA T/R/Tray RoHS: Compliant Min Qty: 9 Package Multiple: 1 | Americas - 885 |
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$7.9167 / $9.5115 | Buy Now |
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MT35XL512ABA1G12-0SIT
Micron Technology Inc
Buy Now
Datasheet
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Compare Parts:
MT35XL512ABA1G12-0SIT
Micron Technology Inc
Flash, 512MX1, PBGA24, TBGA-24
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | TBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | Micron | |
Clock Frequency-Max (fCLK) | 133 MHz | |
JESD-30 Code | R-PBGA-B24 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Memory Density | 536870912 bit | |
Memory IC Type | FLASH | |
Memory Width | 1 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 536870912 words | |
Number of Words Code | 512000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512MX1 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 3 V | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 6 mm |