Datasheets
MT29F256G08CJAABH3-10:A by: Micron Technology Inc

Flash, 32GX8, PBGA100, 12 X 18 MM, 1.40 MM HEIGHT, LEAD FREE, LBGA-100

Part Details for MT29F256G08CJAABH3-10:A by Micron Technology Inc

Overview of MT29F256G08CJAABH3-10:A by Micron Technology Inc

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Part Details for MT29F256G08CJAABH3-10:A

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MT29F256G08CJAABH3-10:A Part Data Attributes

MT29F256G08CJAABH3-10:A Micron Technology Inc
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MT29F256G08CJAABH3-10:A Micron Technology Inc Flash, 32GX8, PBGA100, 12 X 18 MM, 1.40 MM HEIGHT, LEAD FREE, LBGA-100
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description 12 X 18 MM, 1.40 MM HEIGHT, LEAD FREE, LBGA-100
Pin Count 100
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
JESD-30 Code R-PBGA-B100
JESD-609 Code e1
Length 18 mm
Memory Density 274877906944 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 100
Number of Words 34359738368 words
Number of Words Code 32000000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32GX8
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Programming Voltage 2.7 V
Seated Height-Max 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Type MLC NAND TYPE
Width 12 mm

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