Part Details for MT29F1G08ABCH4ET:C by Micron Technology Inc
Overview of MT29F1G08ABCH4ET:C by Micron Technology Inc
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for MT29F1G08ABCH4ET:C
MT29F1G08ABCH4ET:C CAD Models
MT29F1G08ABCH4ET:C Part Data Attributes
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MT29F1G08ABCH4ET:C
Micron Technology Inc
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Datasheet
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MT29F1G08ABCH4ET:C
Micron Technology Inc
Flash, 128MX8, PBGA63, 9 X 11 MM, 1 MM HEIGHT, VFBGA-63
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | BGA | |
Package Description | 9 X 11 MM, 1 MM HEIGHT, VFBGA-63 | |
Pin Count | 63 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
JESD-30 Code | R-PBGA-B63 | |
Length | 11 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 63 | |
Number of Words | 134217728 words | |
Number of Words Code | 128000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 1.8 V | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Type | SLC NAND TYPE | |
Width | 9 mm |