Datasheets
MSC8156SAG1000B by:

OTHER DSP, PBGA783

Part Details for MSC8156SAG1000B by NXP Semiconductors

Overview of MSC8156SAG1000B by NXP Semiconductors

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Applications Computing and Data Storage

Price & Stock for MSC8156SAG1000B

Part # Distributor Description Stock Price Buy
DISTI # 85AK9251
Newark Msc8156Sag1000B Rohs Compliant: Yes |Nxp MSC8156SAG1000B RoHS: Compliant Min Qty: 180 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 25 $220.5900
$220.5900 Buy Now
DISTI # MSC8156SAG1000B
Avnet Americas DSP 32-Bit 1000MHz 783-Pin FCP-BGA - Trays (Alt: MSC8156SAG1000B) RoHS: Compliant Min Qty: 2 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray 307 Partner Stock
RFQ
Bristol Electronics   2340
RFQ
Rochester Electronics StarCore DSP, 6x 1GHz SC3850 cores, MAPLE-B accelerator RoHS: Compliant Status: Obsolete Min Qty: 1 142
  • 1 $272.8800
  • 25 $267.4200
  • 100 $256.5000
  • 500 $245.5900
  • 1,000 $231.9400
$231.9400 / $272.8800 Buy Now
Flip Electronics Stock, ship today 23
RFQ

Part Details for MSC8156SAG1000B

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MSC8156SAG1000B Part Data Attributes

MSC8156SAG1000B NXP Semiconductors
Buy Now Datasheet
Compare Parts:
MSC8156SAG1000B NXP Semiconductors OTHER DSP, PBGA783
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Barrel Shifter NO
Bit Size 32
Boundary Scan YES
Format FIXED POINT
Internal Bus Architecture SINGLE
JESD-30 Code S-PBGA-B783
JESD-609 Code e1
Length 29 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 783
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA783,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
RAM (words) 8192
Seated Height-Max 3.94 mm
Supply Voltage-Max 1.05 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 29 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER

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