Part Details for MSC23V26407TD-60BS8 by LAPIS Semiconductor Co Ltd
Overview of MSC23V26407TD-60BS8 by LAPIS Semiconductor Co Ltd
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Part Details for MSC23V26407TD-60BS8
MSC23V26407TD-60BS8 CAD Models
MSC23V26407TD-60BS8 Part Data Attributes
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MSC23V26407TD-60BS8
LAPIS Semiconductor Co Ltd
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MSC23V26407TD-60BS8
LAPIS Semiconductor Co Ltd
Fast Page DRAM Module, 2MX64, 60ns, CMOS, PDMA168,
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | LAPIS SEMICONDUCTOR CO LTD | |
| Package Description | DIMM, DIMM168 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Access Time-Max | 60 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDMA-N168 | |
| Memory Density | 134217728 bit | |
| Memory IC Type | FAST PAGE DRAM MODULE | |
| Memory Width | 64 | |
| Number of Terminals | 168 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX64 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIMM | |
| Package Equivalence Code | DIMM168 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 2048 | |
| Standby Current-Max | 0.004 A | |
| Supply Current-Max | 0.72 mA | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL |