Part Details for MR3A16ACMA35 by Everspin Technologies
Overview of MR3A16ACMA35 by Everspin Technologies
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Price & Stock for MR3A16ACMA35
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
819-MR3A16ACMA35-ND
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DigiKey | IC RAM 8MBIT PARALLEL 48FBGA Min Qty: 1 Lead time: 20 Weeks Container: Tray |
39 In Stock |
|
$28.6521 / $38.5600 | Buy Now |
|
DISTI #
936-MR3A16ACMA35
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Mouser Electronics | MRAM RoHS: Compliant | 0 |
|
$28.6300 | Order Now |
|
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 480 Package Multiple: 240 Lead time: 20 Weeks Container: Tray | 0Tray |
|
$27.1500 | Buy Now |
|
DISTI #
MR3A16ACMA35
|
EBV Elektronik | (Alt: MR3A16ACMA35) RoHS: Compliant Min Qty: 240 Package Multiple: 240 Lead time: 27 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for MR3A16ACMA35
MR3A16ACMA35 CAD Models
MR3A16ACMA35 Part Data Attributes
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MR3A16ACMA35
Everspin Technologies
Buy Now
Datasheet
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Compare Parts:
MR3A16ACMA35
Everspin Technologies
Memory Circuit,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | EVERSPIN TECHNOLOGIES INC | |
| Package Description | FBGA-48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Date Of Intro | 2019-10-31 | |
| JESD-30 Code | S-PBGA-B48 | |
| Length | 10 mm | |
| Memory Density | 8388608 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.35 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm |