| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
819-1041-ND
|
DigiKey | IC RAM 256KBIT SPI 40MHZ 8DFN Min Qty: 1140 Lead time: 20 Weeks Container: Tray | Limited Supply - Call |
|
$10.3226 | Buy Now | |
|
DISTI #
936-MR25H256MDF
|
Mouser Electronics | MRAM 256Kb 3.3V 32Kx8 SPI RoHS: Compliant | 0 |
|
Order Now | ||
|
DISTI #
V36:1790_06206775
|
Arrow Electronics | MRAM 256Kbit Serial-SPI Interface 3.3V Automotive AEC-Q100 8-Pin DFN EP Tray RoHS: Compliant Min Qty: 1140 Package Multiple: 1140 Lead time: 20 Weeks Date Code: 1838 | Americas - 1 |
|
$9.1570 | Buy Now | |
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1140 Package Multiple: 570 Lead time: 20 Weeks Container: Tray | 0Tray |
|
$9.9300 | Buy Now | ||
|
DISTI #
31290307
|
Verical | MRAM 256Kbit Serial-SPI Interface 3.3V Automotive AEC-Q100 8-Pin DFN EP Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1838 | Americas - 1 |
|
$9.1570 | Buy Now | |
|
DISTI #
MR25H256MDF
|
EBV Elektronik | NVRAM MRAM Serial-SPI 256Kbit 3.3V 8-Pin DFN Tray (Alt: MR25H256MDF) RoHS: Compliant Min Qty: 570 Package Multiple: 570 Lead time: 49 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Not Recommended
|
|
Ihs Manufacturer
|
EVERSPIN TECHNOLOGIES INC
|
|
Part Package Code
|
SON
|
|
Package Description
|
DFN-8
|
|
Pin Count
|
8
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.71
|
|
Samacsys Manufacturer
|
Everspin Technologies
|
|
JESD-30 Code
|
R-PDSO-N8
|
|
JESD-609 Code
|
e3
|
|
Length
|
6 mm
|
|
Memory Density
|
262144 bit
|
|
Memory IC Type
|
MEMORY CIRCUIT
|
|
Memory Width
|
8
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
8
|
|
Number of Words
|
32768 words
|
|
Number of Words Code
|
32000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
32KX8
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
HVSON
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Screening Level
|
AEC-Q100
|
|
Seated Height-Max
|
0.9 mm
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
3 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
AUTOMOTIVE
|
|
Terminal Finish
|
Matte Tin (Sn)
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
DUAL
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
5 mm
|
