Part Details for MR25H256APDF by Everspin Technologies
Overview of MR25H256APDF by Everspin Technologies
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for MR25H256APDF
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
819-MR25H256APDF-ND
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DigiKey | IC RAM 256KBIT SPI 40MHZ 8DFN Min Qty: 1140 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$7.2380 | Buy Now |
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DISTI #
936-MR25H256APDF
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Mouser Electronics | MRAM 256Kb 3.3V 32Kx8 SPI RoHS: Compliant | 0 |
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$6.9100 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1140 Package Multiple: 570 Lead time: 12 Weeks Container: Tray | 0Tray |
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$6.6700 | Buy Now |
|
DISTI #
MR25H256APDF
|
EBV Elektronik | (Alt: MR25H256APDF) RoHS: Compliant Min Qty: 570 Package Multiple: 570 Lead time: 13 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for MR25H256APDF
MR25H256APDF CAD Models
MR25H256APDF Part Data Attributes
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MR25H256APDF
Everspin Technologies
Buy Now
Datasheet
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Compare Parts:
MR25H256APDF
Everspin Technologies
EEPROM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | EVERSPIN TECHNOLOGIES INC | |
| Package Description | HVSON, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Samacsys Manufacturer | Everspin Technologies | |
| JESD-30 Code | R-PDSO-N8 | |
| Length | 6 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | SPI BUS SERIAL EEPROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 5 mm |