Part Details for MPC8548ECVJAUJD by NXP Semiconductors
Overview of MPC8548ECVJAUJD by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC8548ECVJAUJD
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK9080
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Newark | Fg Pq38 8548 Rev 3 Lead-Free/ Tray Rohs Compliant: Yes |Nxp MPC8548ECVJAUJD RoHS: Compliant Min Qty: 36 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$288.2900 | Buy Now |
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Rochester Electronics | PQ38 R3.0 XT WE 1333 RoHS: Compliant Status: Obsolete Min Qty: 1 | 45 |
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$259.8000 / $305.6500 | Buy Now |
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DISTI #
MPC8548ECVJAUJD
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EBV Elektronik | MPU PowerQUICC III RISC 32-Bit 1333MHz 1.8V/2.5V/3.3V 783-Pin FCP-BGA Tray (Alt: MPC8548ECVJAUJD) RoHS: Compliant Min Qty: 36 Package Multiple: 36 Lead time: 54 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock | 82 |
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RFQ | |
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Win Source Electronics | IC MPU MPC85XX 1.333GHZ 783BGA | 793 |
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$234.0000 / $261.0000 | Buy Now |
Part Details for MPC8548ECVJAUJD
MPC8548ECVJAUJD CAD Models
MPC8548ECVJAUJD Part Data Attributes
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MPC8548ECVJAUJD
NXP Semiconductors
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MPC8548ECVJAUJD
NXP Semiconductors
32-BIT, 1333MHz, MICROPROCESSOR, PBGA783
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA-783 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B783 | |
| JESD-609 Code | e2 | |
| Length | 29 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 783 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA783,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.38 mm | |
| Supply Voltage-Max | 1.155 V | |
| Supply Voltage-Min | 1.045 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 29 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |