Part Details for MPC850SRZQ66BU by Freescale Semiconductor
Overview of MPC850SRZQ66BU by Freescale Semiconductor
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- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for MPC850SRZQ66BU
MPC850SRZQ66BU CAD Models
MPC850SRZQ66BU Part Data Attributes
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MPC850SRZQ66BU
Freescale Semiconductor
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Datasheet
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MPC850SRZQ66BU
Freescale Semiconductor
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Reach Compliance Code | not_compliant | |
Bit Size | 32 | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Speed | 66 MHz | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN LEAD SILVER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |