Part Details for MPC850DECVR66BU by NXP Semiconductors
Overview of MPC850DECVR66BU by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC850DECVR66BU
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 540 |
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RFQ |
Part Details for MPC850DECVR66BU
MPC850DECVR66BU CAD Models
MPC850DECVR66BU Part Data Attributes
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MPC850DECVR66BU
NXP Semiconductors
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Datasheet
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MPC850DECVR66BU
NXP Semiconductors
RISC PROCESSOR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA, BGA256,16X16,50 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 2 Days | |
| kg CO2e/kg | 12.2 | |
| Average Weight (mg) | 914.1 | |
| CO2e (mg) | 11152.02 | |
| Samacsys Manufacturer | NXP | |
| Samacsys Modified On | 2024-11-04 11:13:01 | |
| Category CO2 Kg | 12.2 | |
| Compliance Temperature Grade | Industrial: -40C to +95C | |
| EU RoHS Version | RoHS 2 (2015/863/EU) | |
| Candidate List Date | 2020-01-16 | |
| Conflict Mineral Status | DRC Conflict Free | |
| Conflict Mineral Status Source | CMRT V5.11 | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.54 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC850DECVR66BU
This table gives cross-reference parts and alternative options found for MPC850DECVR66BU. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC850DECVR66BU, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC850DECVR66BU | PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C | Freescale Semiconductor | MPC850DECVR66BU vs MPC850DECVR66BU |