Part Details for MPC5644AF0MVZ3 by NXP Semiconductors
Overview of MPC5644AF0MVZ3 by NXP Semiconductors
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- Part Data Attributes: (Available)
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Part Details for MPC5644AF0MVZ3
MPC5644AF0MVZ3 CAD Models
MPC5644AF0MVZ3 Part Data Attributes
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MPC5644AF0MVZ3
NXP Semiconductors
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Datasheet
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MPC5644AF0MVZ3
NXP Semiconductors
IC,MICROCONTROLLER,32-BIT,E200Z4 CPU,BGA,324PIN,PLASTIC
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | E200Z4 | |
| Clock Frequency-Max | 80 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B324 | |
| Length | 23 mm | |
| Number of I/O Lines | 111 | |
| Number of Terminals | 324 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 196608 | |
| ROM (words) | 4194304 | |
| ROM Programmability | FLASH | |
| Speed | 80 MHz | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |