Part Details for MPC5554MZP80R2 by NXP Semiconductors
Overview of MPC5554MZP80R2 by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for MPC5554MZP80R2
MPC5554MZP80R2 CAD Models
MPC5554MZP80R2 Part Data Attributes
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MPC5554MZP80R2
NXP Semiconductors
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Datasheet
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MPC5554MZP80R2
NXP Semiconductors
32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA416
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Rohs Code | No | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | HBGA, BGA416,26X26,40 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Additional Feature | IT ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 24 | |
Bit Size | 32 | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B416 | |
JESD-609 Code | e0 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 416 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA416,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 245 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 2097152 | |
ROM Programmability | FLASH | |
Seated Height-Max | 2.55 mm | |
Speed | 80 MHz | |
Supply Current-Max | 600 mA | |
Supply Voltage-Max | 1.65 V | |
Supply Voltage-Min | 1.35 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 27 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Alternate Parts for MPC5554MZP80R2
This table gives cross-reference parts and alternative options found for MPC5554MZP80R2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC5554MZP80R2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MPC5554MZP80R2 | 32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | Freescale Semiconductor | MPC5554MZP80R2 vs MPC5554MZP80R2 |
MPC5554MVR80R2 | MICROCONTROLLER | NXP Semiconductors | MPC5554MZP80R2 vs MPC5554MVR80R2 |
MPC5554MVR80R2 | 32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 | Freescale Semiconductor | MPC5554MZP80R2 vs MPC5554MVR80R2 |