Datasheets
MPC5554MZP80R2 by:

32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA416

Part Details for MPC5554MZP80R2 by NXP Semiconductors

Overview of MPC5554MZP80R2 by NXP Semiconductors

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

Part Details for MPC5554MZP80R2

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MPC5554MZP80R2 Part Data Attributes

MPC5554MZP80R2 NXP Semiconductors
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MPC5554MZP80R2 NXP Semiconductors 32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA416
Rohs Code No
Part Life Cycle Code Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description HBGA, BGA416,26X26,40
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES
Additional Feature IT ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 24
Bit Size 32
Clock Frequency-Max 20 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 32
JESD-30 Code S-PBGA-B416
JESD-609 Code e0
Length 27 mm
Moisture Sensitivity Level 3
Number of Terminals 416
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA416,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
RAM (bytes) 65536
ROM (words) 2097152
ROM Programmability FLASH
Seated Height-Max 2.55 mm
Speed 80 MHz
Supply Current-Max 600 mA
Supply Voltage-Max 1.65 V
Supply Voltage-Min 1.35 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

Alternate Parts for MPC5554MZP80R2

This table gives cross-reference parts and alternative options found for MPC5554MZP80R2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC5554MZP80R2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MPC5554MZP80R2 32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 Freescale Semiconductor MPC5554MZP80R2 vs MPC5554MZP80R2
MPC5554MVR80R2 MICROCONTROLLER NXP Semiconductors MPC5554MZP80R2 vs MPC5554MVR80R2
MPC5554MVR80R2 32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 Freescale Semiconductor MPC5554MZP80R2 vs MPC5554MVR80R2
Part Number Description Manufacturer Compare
MPC5554MVR80R2 32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 Freescale Semiconductor MPC5554MZP80R2 vs MPC5554MVR80R2
MPC5554MZP80R2 32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 Freescale Semiconductor MPC5554MZP80R2 vs MPC5554MZP80R2

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