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Overview of ML67Q5003LA by LAPIS Semiconductor Co Ltd
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for ML67Q5003LA by LAPIS Semiconductor Co Ltd
Part Data Attributes for ML67Q5003LA by LAPIS Semiconductor Co Ltd
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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LAPIS SEMICONDUCTOR CO LTD
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Part Package Code
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BGA
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Package Description
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LFBGA, BGA144,13X13,32
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Pin Count
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144
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Reach Compliance Code
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unknown
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ECCN Code
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3A991.A.2
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HTS Code
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8542.31.00.01
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Has ADC
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YES
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Additional Feature
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IT ALSO REQUIRES 3.3V I/O SUPPLY
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Address Bus Width
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24
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Bit Size
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32
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CPU Family
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ARM7
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Clock Frequency-Max
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56 MHz
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DAC Channels
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NO
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DMA Channels
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YES
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External Data Bus Width
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16
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JESD-30 Code
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S-PBGA-B144
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JESD-609 Code
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e0
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Length
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11 mm
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Number of I/O Lines
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42
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Number of Terminals
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144
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On Chip Program ROM Width
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8
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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PWM Channels
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YES
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LFBGA
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Package Equivalence Code
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BGA144,13X13,32
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, LOW PROFILE, FINE PITCH
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Qualification Status
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Not Qualified
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RAM (bytes)
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32768
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ROM (words)
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262144
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ROM Programmability
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FLASH
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Seated Height-Max
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1.5 mm
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Speed
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60 MHz
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Supply Voltage-Max
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2.75 V
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Supply Voltage-Min
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2.5 V
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Supply Voltage-Nom
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2.5 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Finish
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TIN LEAD
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Terminal Form
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BALL
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Terminal Pitch
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0.8 mm
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Terminal Position
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BOTTOM
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Width
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11 mm
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uPs/uCs/Peripheral ICs Type
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MICROCONTROLLER, RISC
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