Part Details for MF3MODH2101DA4/05 by NXP Semiconductors
Overview of MF3MODH2101DA4/05 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Price & Stock for MF3MODH2101DA4/05
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MF3MODH2101DA4/05,
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Avnet Americas | Contactless Multi-Application IC PLLMC T/R - Tape and Reel (Alt: MF3MODH2101DA4/05,) RoHS: Not Compliant Min Qty: 17500 Package Multiple: 17500 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
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$1.2839 / $1.4113 | Buy Now |
Part Details for MF3MODH2101DA4/05
MF3MODH2101DA4/05 CAD Models
MF3MODH2101DA4/05 Part Data Attributes
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MF3MODH2101DA4/05
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MF3MODH2101DA4/05
NXP Semiconductors
Microprocessor Circuit
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| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | SOT500-2 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 5A992 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 16 Weeks | |
| JESD-30 Code | X-PXMA-N | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | XMA | |
| Package Shape | UNSPECIFIED | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | NO LEAD | |
| Terminal Position | UNSPECIFIED | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |