Datasheets
MCM69L735ZP6.5 by:

Cache SRAM, 128KX36, 6.5ns, MOS, PBGA119, 7 X 17 MM, PLASTIC, BGA-119

Part Details for MCM69L735ZP6.5 by Motorola Semiconductor Products

Overview of MCM69L735ZP6.5 by Motorola Semiconductor Products

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Applications Computing and Data Storage Financial Technology (Fintech)

Part Details for MCM69L735ZP6.5

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MCM69L735ZP6.5 Part Data Attributes

MCM69L735ZP6.5 Motorola Semiconductor Products
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MCM69L735ZP6.5 Motorola Semiconductor Products Cache SRAM, 128KX36, 6.5ns, MOS, PBGA119, 7 X 17 MM, PLASTIC, BGA-119
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Package Description BGA,
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 6.5 ns
JESD-30 Code R-PBGA-B119
JESD-609 Code e0
Length 22 mm
Memory Density 4718592 bit
Memory IC Type CACHE SRAM
Memory Width 36
Number of Functions 1
Number of Ports 1
Number of Terminals 119
Number of Words 131072 words
Number of Words Code 128000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX36
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.4 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology MOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm

Alternate Parts for MCM69L735ZP6.5

This table gives cross-reference parts and alternative options found for MCM69L735ZP6.5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MCM69L735ZP6.5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HM66AEB36102BP-30 1MX36 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165 Renesas Electronics Corporation MCM69L735ZP6.5 vs HM66AEB36102BP-30
K7N401801A-TC160 ZBT SRAM, 256KX18, 3.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Samsung Semiconductor MCM69L735ZP6.5 vs K7N401801A-TC160
IBM0436A41QLAB-3P Standard SRAM, 128KX36, 1.5ns, CMOS, PBGA119, BGA-119 IBM MCM69L735ZP6.5 vs IBM0436A41QLAB-3P
IDT71V2546XS133PF ZBT SRAM, 128KX36, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc MCM69L735ZP6.5 vs IDT71V2546XS133PF
IS61DDP2B21M36A-400B4L DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc MCM69L735ZP6.5 vs IS61DDP2B21M36A-400B4L
KM732V789H-67 Cache SRAM, 128KX32, 3.8ns, CMOS, PBGA119, BGA-119 Samsung Semiconductor MCM69L735ZP6.5 vs KM732V789H-67
K7P163612M-HC48 Standard SRAM, 512KX36, 4.8ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FLIP CHIP, BGA-119 Samsung Semiconductor MCM69L735ZP6.5 vs K7P163612M-HC48
CXK77N36R160GB-33 Late-Write SRAM, 512KX36, 1.7ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 Sony Semiconductor MCM69L735ZP6.5 vs CXK77N36R160GB-33
CY7C1382FV25-200BGC Cache SRAM, 1MX18, 3ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 Cypress Semiconductor MCM69L735ZP6.5 vs CY7C1382FV25-200BGC
CY7C1324H-100AXC Cache SRAM, 128KX18, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-100 Cypress Semiconductor MCM69L735ZP6.5 vs CY7C1324H-100AXC

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