Datasheets
MCM64E918FC4.4 by:

DDR SRAM, 512KX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153

Part Details for MCM64E918FC4.4 by Motorola Semiconductor Products

Overview of MCM64E918FC4.4 by Motorola Semiconductor Products

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for MCM64E918FC4.4

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MCM64E918FC4.4 Part Data Attributes

MCM64E918FC4.4 Motorola Semiconductor Products
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MCM64E918FC4.4 Motorola Semiconductor Products DDR SRAM, 512KX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Package Description BGA,
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.2 ns
JESD-30 Code R-PBGA-B153
Length 22 mm
Memory Density 9437184 bit
Memory IC Type DDR SRAM
Memory Width 18
Number of Functions 1
Number of Terminals 153
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX18
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.77 mm
Supply Voltage-Max (Vsup) 2.625 V
Supply Voltage-Min (Vsup) 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm

Alternate Parts for MCM64E918FC4.4

This table gives cross-reference parts and alternative options found for MCM64E918FC4.4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MCM64E918FC4.4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CXK77R1882AGB-39 DDR SRAM, 512KX18, 2.6ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 Sony Semiconductor MCM64E918FC4.4 vs CXK77R1882AGB-39
MCM64E918RS3.3 DDR SRAM, 512KX18, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 Motorola Semiconductor Products MCM64E918FC4.4 vs MCM64E918RS3.3
MCM64E918RS3.0R DDR SRAM, 512KX18, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 Motorola Semiconductor Products MCM64E918FC4.4 vs MCM64E918RS3.0R
IBM0418A8CBLBB-4 Standard SRAM, 512KX18, 2ns, CMOS, PBGA153, BGA-153 IBM MCM64E918FC4.4 vs IBM0418A8CBLBB-4
MCM64E918FC3.3R 512KX18 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 Motorola Mobility LLC MCM64E918FC4.4 vs MCM64E918FC3.3R
MCM64E918RS5.0R 512KX18 DDR SRAM, 0.2ns, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 Motorola Mobility LLC MCM64E918FC4.4 vs MCM64E918RS5.0R
MCM64E918FC5.0 DDR SRAM, 512KX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 Motorola Semiconductor Products MCM64E918FC4.4 vs MCM64E918FC5.0
IBM0418A8CFLBB-4 Standard SRAM, 512KX18, 2ns, CMOS, PBGA153, BGA-153 IBM MCM64E918FC4.4 vs IBM0418A8CFLBB-4
MCM64E918FC3.0 512KX18 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 Freescale Semiconductor MCM64E918FC4.4 vs MCM64E918FC3.0
MCM64E918RS4.4 DDR SRAM, 512KX18, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 Motorola Semiconductor Products MCM64E918FC4.4 vs MCM64E918RS4.4

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