Datasheets
MCM63F819KZP9R by:

Cache SRAM, 256KX18, 9ns, CMOS, PBGA119, PLASTIC, BGA-119

Part Details for MCM63F819KZP9R by Motorola Semiconductor Products

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Part Details for MCM63F819KZP9R

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MCM63F819KZP9R Part Data Attributes

MCM63F819KZP9R Motorola Semiconductor Products
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MCM63F819KZP9R Motorola Semiconductor Products Cache SRAM, 256KX18, 9ns, CMOS, PBGA119, PLASTIC, BGA-119
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Package Description BGA,
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 9 ns
Additional Feature FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PBGA-B119
JESD-609 Code e0
Length 22 mm
Memory Density 4718592 bit
Memory IC Type CACHE SRAM
Memory Width 18
Number of Functions 1
Number of Terminals 119
Number of Words 262144 words
Number of Words Code 256000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX18
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.4 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm

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