Part Details for MCM4027BEBD25 by Freescale Semiconductor
Overview of MCM4027BEBD25 by Freescale Semiconductor
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- Part Data Attributes: (Available)
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Part Details for MCM4027BEBD25
MCM4027BEBD25 CAD Models
MCM4027BEBD25 Part Data Attributes
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MCM4027BEBD25
Freescale Semiconductor
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Datasheet
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MCM4027BEBD25
Freescale Semiconductor
IC,DRAM,PAGE MODE,4KX1,MOS,DIP,16PIN,CERAMIC
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MOTOROLA SEMICONDUCTOR PRODUCTS | |
| Package Description | DIP, DIP16,.3 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Access Time-Max | 250 ns | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-XDIP-T16 | |
| JESD-609 Code | e0 | |
| Memory Density | 4096 bit | |
| Memory IC Type | PAGE MODE DRAM | |
| Memory Width | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 4KX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Refresh Cycles | 64 | |
| Surface Mount | NO | |
| Technology | MOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |