Part Details for MCM32257BZ15 by Freescale Semiconductor
Overview of MCM32257BZ15 by Freescale Semiconductor
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Part Details for MCM32257BZ15
MCM32257BZ15 CAD Models
MCM32257BZ15 Part Data Attributes
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MCM32257BZ15
Freescale Semiconductor
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Datasheet
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MCM32257BZ15
Freescale Semiconductor
MEMORY MODULE,SRAM,256KX32,CMOS,ZIP,64PIN,PLASTIC
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MOTOROLA SEMICONDUCTOR PRODUCTS | |
Package Description | ZIP, ZIP64/68,.1,.1 | |
Reach Compliance Code | unknown | |
Access Time-Max | 15 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PZIP-T64 | |
JESD-609 Code | e0 | |
Memory Density | 8388608 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 32 | |
Number of Terminals | 64 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX32 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | ZIP | |
Package Equivalence Code | ZIP64/68,.1,.1 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Power Supplies | 5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 13.97 mm | |
Standby Current-Max | 0.04 A | |
Standby Voltage-Min | 4.5 V | |
Supply Current-Max | 0.96 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 1.27 mm | |
Terminal Position | ZIG-ZAG |