Datasheets
MCM32257BZ15 by:

MEMORY MODULE,SRAM,256KX32,CMOS,ZIP,64PIN,PLASTIC

Part Details for MCM32257BZ15 by Freescale Semiconductor

Overview of MCM32257BZ15 by Freescale Semiconductor

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Part Details for MCM32257BZ15

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MCM32257BZ15 Part Data Attributes

MCM32257BZ15 Freescale Semiconductor
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MCM32257BZ15 Freescale Semiconductor MEMORY MODULE,SRAM,256KX32,CMOS,ZIP,64PIN,PLASTIC
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description ZIP, ZIP64/68,.1,.1
Reach Compliance Code unknown
Access Time-Max 15 ns
I/O Type COMMON
JESD-30 Code R-PZIP-T64
JESD-609 Code e0
Memory Density 8388608 bit
Memory IC Type SRAM MODULE
Memory Width 32
Number of Terminals 64
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code ZIP
Package Equivalence Code ZIP64/68,.1,.1
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Power Supplies 5 V
Qualification Status Not Qualified
Seated Height-Max 13.97 mm
Standby Current-Max 0.04 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.96 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position ZIG-ZAG

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