Part Details for MCM2167HP70 by Motorola Semiconductor Products
Overview of MCM2167HP70 by Motorola Semiconductor Products
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MCM2167HP70
MCM2167HP70 CAD Models
MCM2167HP70 Part Data Attributes
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MCM2167HP70
Motorola Semiconductor Products
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Datasheet
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MCM2167HP70
Motorola Semiconductor Products
Standard SRAM, 16KX1, 70ns, MOS, PDIP20
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MOTOROLA INC | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 70 ns | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PDIP-T20 | |
JESD-609 Code | e0 | |
Memory Density | 16384 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 1 | |
Number of Terminals | 20 | |
Number of Words | 16384 words | |
Number of Words Code | 16000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 16KX1 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP20,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Supply Current-Max | 0.12 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | MOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |