Part Details for MCCF33095 by NXP Semiconductors
Overview of MCCF33095 by NXP Semiconductors
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- Part Data Attributes: (Available)
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Part Details for MCCF33095
MCCF33095 CAD Models
MCCF33095 Part Data Attributes
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MCCF33095
NXP Semiconductors
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Datasheet
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MCCF33095
NXP Semiconductors
Analog Circuit
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Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | FLIP CHIP-10 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Analog IC - Other Type | ANALOG CIRCUIT | |
JESD-30 Code | R-PBGA-B10 | |
Length | 2.032 mm | |
Number of Functions | 1 | |
Number of Terminals | 10 | |
Operating Temperature-Max | 170 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Seated Height-Max | 0.699 mm | |
Surface Mount | YES | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Width | 1.905 mm |