Datasheets
MCCF33095 by:

Analog Circuit

Part Details for MCCF33095 by NXP Semiconductors

Overview of MCCF33095 by NXP Semiconductors

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Part Details for MCCF33095

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MCCF33095 Part Data Attributes

MCCF33095 NXP Semiconductors
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MCCF33095 NXP Semiconductors Analog Circuit
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description FLIP CHIP-10
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Analog IC - Other Type ANALOG CIRCUIT
JESD-30 Code R-PBGA-B10
Length 2.032 mm
Number of Functions 1
Number of Terminals 10
Operating Temperature-Max 170 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Seated Height-Max 0.699 mm
Surface Mount YES
Temperature Grade AUTOMOTIVE
Terminal Form BALL
Terminal Position BOTTOM
Width 1.905 mm

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