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Overview of MC9S12D64MPV by Motorola Semiconductor Products
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
CAD Models for MC9S12D64MPV by Motorola Semiconductor Products
Part Data Attributes for MC9S12D64MPV by Motorola Semiconductor Products
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
MOTOROLA INC
|
Package Description
|
LQFP-112
|
Reach Compliance Code
|
unknown
|
HTS Code
|
8542.31.00.01
|
Has ADC
|
YES
|
Additional Feature
|
ALSO REQUIRES 5V SUPPLY
|
Address Bus Width
|
16
|
Bit Size
|
16
|
CPU Family
|
CPU12
|
Clock Frequency-Max
|
16 MHz
|
DAC Channels
|
NO
|
DMA Channels
|
NO
|
External Data Bus Width
|
16
|
JESD-30 Code
|
S-PQFP-G112
|
Length
|
20 mm
|
Number of I/O Lines
|
91
|
Number of Terminals
|
112
|
On Chip Program ROM Width
|
8
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-40 °C
|
PWM Channels
|
YES
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LQFP
|
Package Equivalence Code
|
QFP112,.87SQ
|
Package Shape
|
SQUARE
|
Package Style
|
FLATPACK, LOW PROFILE
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Qualification Status
|
Not Qualified
|
RAM (bytes)
|
4096
|
ROM (words)
|
65536
|
ROM Programmability
|
FLASH
|
Seated Height-Max
|
1.6 mm
|
Speed
|
25 MHz
|
Supply Voltage-Max
|
2.75 V
|
Supply Voltage-Min
|
2.35 V
|
Supply Voltage-Nom
|
2.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
AUTOMOTIVE
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.65 mm
|
Terminal Position
|
QUAD
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
20 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER
|
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