Part Details for MC9S12C96CPBE25 by NXP Semiconductors
Overview of MC9S12C96CPBE25 by NXP Semiconductors
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Applications
Industrial Automation
Transportation and Logistics
Healthcare
Renewable Energy
Automotive
Robotics and Drones
Part Details for MC9S12C96CPBE25
MC9S12C96CPBE25 CAD Models
MC9S12C96CPBE25 Part Data Attributes
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MC9S12C96CPBE25
NXP Semiconductors
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Datasheet
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MC9S12C96CPBE25
NXP Semiconductors
MICROCONTROLLER
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | LQFP, | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Date Of Intro | 2016-04-02 | |
Has ADC | YES | |
Additional Feature | ALSO REQUIRES 5V SUPPLY | |
Address Bus Width | 16 | |
Bit Size | 16 | |
Boundary Scan | NO | |
Clock Frequency-Max | 50 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | 16 | |
JESD-30 Code | S-PQFP-G52 | |
Length | 10 mm | |
Number of I/O Lines | 35 | |
Number of Terminals | 52 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE | |
ROM (words) | 98304 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.7 mm | |
Speed | 25 MHz | |
Supply Voltage-Max | 2.75 V | |
Supply Voltage-Min | 2.35 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |