Part Details for MC7447AVU1167NB by NXP Semiconductors
Overview of MC7447AVU1167NB by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MC7447AVU1167NB
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK8652
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Newark | A7Pm Pb-Free/ Tray Rohs Compliant: Yes |Nxp MC7447AVU1167NB RoHS: Compliant Min Qty: 44 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$524.2100 | Buy Now |
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Rochester Electronics | RISC Microprocessor, 32-Bit, Power Architecture, 1167MHz, CMOS, CBGA360 RoHS: Compliant Status: Obsolete Min Qty: 1 | 32 |
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$472.4000 / $555.7700 | Buy Now |
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Flip Electronics | Stock | 270 |
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RFQ |
Part Details for MC7447AVU1167NB
MC7447AVU1167NB CAD Models
MC7447AVU1167NB Part Data Attributes
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MC7447AVU1167NB
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC7447AVU1167NB
NXP Semiconductors
32-BIT, 1167MHz, RISC PROCESSOR, CBGA360
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.1 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 4 Weeks | |
Additional Feature | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | |
Address Bus Width | 36 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 167 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B360 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 360 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.8 mm | |
Speed | 1167 MHz | |
Supply Voltage-Max | 1.35 V | |
Supply Voltage-Min | 1.25 V | |
Supply Voltage-Nom | 1.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MC7447AVU1167NB
This table gives cross-reference parts and alternative options found for MC7447AVU1167NB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC7447AVU1167NB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MC7447AVU1167NB | 32-BIT, 1167MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 | Freescale Semiconductor | MC7447AVU1167NB vs MC7447AVU1167NB |
PC7447AVGHY1167LC | RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360 | Teledyne e2v | MC7447AVU1167NB vs PC7447AVGHY1167LC |
PC7447AVLH1167LC | RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 | Atmel Corporation | MC7447AVU1167NB vs PC7447AVLH1167LC |
MC7447ATHX1167NB | 32-BIT, 1167MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | MC7447AVU1167NB vs MC7447ATHX1167NB |
PC7447AVGH1167LC | RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | MC7447AVU1167NB vs PC7447AVGH1167LC |
PC7447AVLH1167LC | RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 | Teledyne e2v | MC7447AVU1167NB vs PC7447AVLH1167LC |
PC7447AVGH1167LC | RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Teledyne e2v | MC7447AVU1167NB vs PC7447AVGH1167LC |
MC7447ATHX1167NB | 32-BIT, 1167MHz, RISC PROCESSOR, CBGA360 | NXP Semiconductors | MC7447AVU1167NB vs MC7447ATHX1167NB |
MC7447AHX1167NB | APOLO7PM,RV1.1,1.1V,105C | Freescale Semiconductor | MC7447AVU1167NB vs MC7447AHX1167NB |