Datasheets
MC7447AVU1167NB by:

32-BIT, 1167MHz, RISC PROCESSOR, CBGA360

Part Details for MC7447AVU1167NB by NXP Semiconductors

Overview of MC7447AVU1167NB by NXP Semiconductors

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Price & Stock for MC7447AVU1167NB

Part # Distributor Description Stock Price Buy
DISTI # 85AK8652
Newark A7Pm Pb-Free/ Tray Rohs Compliant: Yes |Nxp MC7447AVU1167NB RoHS: Compliant Min Qty: 44 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 25 $524.2100
$524.2100 Buy Now
Rochester Electronics RISC Microprocessor, 32-Bit, Power Architecture, 1167MHz, CMOS, CBGA360 RoHS: Compliant Status: Obsolete Min Qty: 1 32
  • 1 $555.7700
  • 25 $544.6500
  • 100 $522.4200
  • 500 $500.1900
  • 1,000 $472.4000
$472.4000 / $555.7700 Buy Now
Flip Electronics Stock 270
RFQ

Part Details for MC7447AVU1167NB

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MC7447AVU1167NB Part Data Attributes

MC7447AVU1167NB NXP Semiconductors
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MC7447AVU1167NB NXP Semiconductors 32-BIT, 1167MHz, RISC PROCESSOR, CBGA360
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360
Reach Compliance Code unknown
ECCN Code 3A991.A.1
HTS Code 8542.31.00.01
Factory Lead Time 4 Weeks
Additional Feature ALSO REQUIRES 1.8V OR 2.5V SUPPLY
Address Bus Width 36
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 167 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 2.8 mm
Speed 1167 MHz
Supply Voltage-Max 1.35 V
Supply Voltage-Min 1.25 V
Supply Voltage-Nom 1.3 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MC7447AVU1167NB

This table gives cross-reference parts and alternative options found for MC7447AVU1167NB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC7447AVU1167NB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MC7447AVU1167NB 32-BIT, 1167MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 Freescale Semiconductor MC7447AVU1167NB vs MC7447AVU1167NB
PC7447AVGHY1167LC RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360 Teledyne e2v MC7447AVU1167NB vs PC7447AVGHY1167LC
PC7447AVLH1167LC RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 Atmel Corporation MC7447AVU1167NB vs PC7447AVLH1167LC
MC7447ATHX1167NB 32-BIT, 1167MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor MC7447AVU1167NB vs MC7447ATHX1167NB
PC7447AVGH1167LC RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation MC7447AVU1167NB vs PC7447AVGH1167LC
PC7447AVLH1167LC RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, LGA-360 Teledyne e2v MC7447AVU1167NB vs PC7447AVLH1167LC
PC7447AVGH1167LC RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v MC7447AVU1167NB vs PC7447AVGH1167LC
MC7447ATHX1167NB 32-BIT, 1167MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors MC7447AVU1167NB vs MC7447ATHX1167NB
MC7447AHX1167NB APOLO7PM,RV1.1,1.1V,105C Freescale Semiconductor MC7447AVU1167NB vs MC7447AHX1167NB
Part Number Description Manufacturer Compare
PCX7447VGU1150NB RISC Microprocessor, 32-Bit, 1150MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation MC7447AVU1167NB vs PCX7447VGU1150NB
PC7447AVGHY1167LC RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360 Teledyne e2v MC7447AVU1167NB vs PC7447AVGHY1167LC
PCX7447AMGH1167NB RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v MC7447AVU1167NB vs PCX7447AMGH1167NB
PCX7447MGU1150NB RISC Microprocessor, 32-Bit, 1150MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation MC7447AVU1167NB vs PCX7447MGU1150NB
PCX7447AMGHY1167NB RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, HITCE, BGA-360 Teledyne e2v MC7447AVU1167NB vs PCX7447AMGHY1167NB
PCX7447AMLH1167NB RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HCTE, LGA-360 Teledyne e2v MC7447AVU1167NB vs PCX7447AMLH1167NB
PC7447AVGH1167LC RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v MC7447AVU1167NB vs PC7447AVGH1167LC
MC7447ATHX1167NB 32-BIT, 1167MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors MC7447AVU1167NB vs MC7447ATHX1167NB
PC7447AVGHY1167NC RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HITCE, CERAMIC, BGA-360 Teledyne e2v MC7447AVU1167NB vs PC7447AVGHY1167NC
PC7447AVLH1167NB RISC Microprocessor, 32-Bit, 1167MHz, CMOS, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HCTE, LGA-360 Teledyne e2v MC7447AVU1167NB vs PC7447AVLH1167NB

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