Part Details for MC68MH360VR25VL by NXP Semiconductors
Overview of MC68MH360VR25VL by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for MC68MH360VR25VL
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MC68MH360VR25VL
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Avnet Americas | MPU M683xx RISC 32-Bit 0.57um 25MHz 357-Pin BGA Tray - Trays (Alt: MC68MH360VR25VL) RoHS: Compliant Min Qty: 4 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 34 Partner Stock |
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$92.6900 / $106.8925 | Buy Now |
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Flip Electronics | Stock | 186 |
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RFQ |
Part Details for MC68MH360VR25VL
MC68MH360VR25VL CAD Models
MC68MH360VR25VL Part Data Attributes
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MC68MH360VR25VL
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC68MH360VR25VL
NXP Semiconductors
10Mbps, SERIAL COMM CONTROLLER, PBGA357
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 1.27 MM PITCH, PLASTIC, BGA-357 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Additional Feature | ALSO OPERATES AT 3.3 V | |
| Address Bus Width | 32 | |
| Boundary Scan | YES | |
| Bus Compatibility | MC68040; MC68030 | |
| Clock Frequency-Max | 25 MHz | |
| Communication Protocol | ASYNC, BIT | |
| Data Encoding/Decoding Method | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL (MANCHESTER) | |
| Data Transfer Rate-Max | 1.25 MBps | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e1 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Serial I/Os | 1 | |
| Number of Terminals | 357 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.86 mm | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |