Part Details for MC6860LDS by Freescale Semiconductor
Overview of MC6860LDS by Freescale Semiconductor
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MC6860LDS
MC6860LDS CAD Models
MC6860LDS Part Data Attributes:
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MC6860LDS
Freescale Semiconductor
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Datasheet
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MC6860LDS
Freescale Semiconductor
IC,MODEM CIRCUIT,MODEM,MOS,DIP,24PIN,CERAMIC
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MOTOROLA SEMICONDUCTOR PRODUCTS | |
Package Description | DIP, DIP24,.6 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | R-XDIP-T24 | |
JESD-609 Code | e0 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Surface Mount | NO | |
Technology | MOS | |
Telecom IC Type | MODEM | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |