There are no models available for this part yet.
Overview of MC13783VK5 by Freescale Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Energy and Power Systems
Renewable Energy
Price & Stock for MC13783VK5 by Freescale Semiconductor
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Chip 1 Exchange | INSTOCK | 55 |
|
RFQ | |||
| Component Electronics, Inc | IN STOCK SHIP TODAY | 981 |
|
$15.0000 / $23.0800 | Buy Now | ||
| Win Source Electronics | High-Performance Audio Functions to 247-Pin MAP-BGA Tray / IC PWR MNGMNT ATLAS 3G 247MAPBGA | 10084 |
|
$12.2470 / $18.3700 | Buy Now |
CAD Models for MC13783VK5 by Freescale Semiconductor
Part Data Attributes for MC13783VK5 by Freescale Semiconductor
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
FREESCALE SEMICONDUCTOR INC
|
|
Package Description
|
BGA-247
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.39.00.01
|
|
Samacsys Manufacturer
|
NXP
|
|
JESD-30 Code
|
S-PBGA-B247
|
|
Length
|
10 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
247
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-30 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TFBGA
|
|
Package Equivalence Code
|
BGA247,19X19,20
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.2 mm
|
|
Surface Mount
|
YES
|
|
Temperature Grade
|
OTHER
|
|
Terminal Finish
|
TIN SILVER COPPER OVER NICKEL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.5 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
|
Width
|
10 mm
|
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