Part Details for MC-242453F9-B95-BS1 by NEC Electronics Group
Overview of MC-242453F9-B95-BS1 by NEC Electronics Group
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Part Details for MC-242453F9-B95-BS1
MC-242453F9-B95-BS1 CAD Models
MC-242453F9-B95-BS1 Part Data Attributes
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MC-242453F9-B95-BS1
NEC Electronics Group
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Datasheet
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MC-242453F9-B95-BS1
NEC Electronics Group
Memory Circuit, 2MX16, CMOS, PBGA71, 11 X 7 MM, FBGA-71
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NEC ELECTRONICS CORP | |
Part Package Code | BGA | |
Package Description | LFBGA, | |
Pin Count | 71 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM | |
JESD-30 Code | R-PBGA-B71 | |
Length | 11 mm | |
Memory Density | 33554432 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 71 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | -20 °C | |
Organization | 2MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.21 mm | |
Supply Voltage-Max (Vsup) | 3 V | |
Supply Voltage-Min (Vsup) | 2.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 7 mm |