Part Details for MC-242453F9-B10-BS1 by Renesas Electronics Corporation
Overview of MC-242453F9-B10-BS1 by Renesas Electronics Corporation
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Part Details for MC-242453F9-B10-BS1
MC-242453F9-B10-BS1 CAD Models
MC-242453F9-B10-BS1 Part Data Attributes
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MC-242453F9-B10-BS1
Renesas Electronics Corporation
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MC-242453F9-B10-BS1
Renesas Electronics Corporation
IC,MIXED MEMORY,FLASH+SRAM,HYBRID,BGA,77PIN,PLASTIC
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 100 ns | |
JESD-30 Code | R-PBGA-B77 | |
Memory IC Type | MEMORY CIRCUIT | |
Mixed Memory Type | FLASH+SRAM | |
Number of Terminals | 77 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | -20 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA77,8X14,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, FINE PITCH | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.00001 A | |
Supply Current-Max | 0.045 mA | |
Surface Mount | YES | |
Technology | HYBRID | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM |