Part Details for MBM29DL322TD12PBT by FUJITSU Semiconductor Limited
Overview of MBM29DL322TD12PBT by FUJITSU Semiconductor Limited
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Part Details for MBM29DL322TD12PBT
MBM29DL322TD12PBT CAD Models
MBM29DL322TD12PBT Part Data Attributes
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MBM29DL322TD12PBT
FUJITSU Semiconductor Limited
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Datasheet
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MBM29DL322TD12PBT
FUJITSU Semiconductor Limited
Flash, 2MX16, 120ns, PBGA57, PLASTIC, FBGA-57
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FUJITSU SEMICONDUCTOR AMERICA INC | |
| Package Description | PLASTIC, FBGA-57 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 120 ns | |
| Alternate Memory Width | 8 | |
| Boot Block | TOP | |
| JESD-30 Code | R-PBGA-B57 | |
| Length | 13.95 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 57 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Type | NOR TYPE | |
| Width | 7.95 mm |