Part Details for MBM27C64-30Z-X by FUJITSU Semiconductor Limited
Overview of MBM27C64-30Z-X by FUJITSU Semiconductor Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Environmental Monitoring
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Agriculture Technology
Telecommunications
Medical Imaging
Part Details for MBM27C64-30Z-X
MBM27C64-30Z-X CAD Models
MBM27C64-30Z-X Part Data Attributes
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MBM27C64-30Z-X
FUJITSU Semiconductor Limited
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Datasheet
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MBM27C64-30Z-X
FUJITSU Semiconductor Limited
IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC
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| Rohs Code | No | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | FUJITSU LTD | |
| Package Description | DIP, DIP28,.6 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-XDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 21 V | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for MBM27C64-30Z-X
This table gives cross-reference parts and alternative options found for MBM27C64-30Z-X. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBM27C64-30Z-X, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM27C64-30Z-W | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC | FUJITSU Semiconductor Limited | MBM27C64-30Z-X vs MBM27C64-30Z-W |
| TMS27C64-30JL | 8KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | MBM27C64-30Z-X vs TMS27C64-30JL |
| 27C64MQG/B30 | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | MBM27C64-30Z-X vs 27C64MQG/B30 |
| AM27C64-300DI | UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | MBM27C64-30Z-X vs AM27C64-300DI |
| MBM27C64-30-XZ | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | MBM27C64-30Z-X vs MBM27C64-30-XZ |
| 27C64MQG/B30 | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | MBM27C64-30Z-X vs 27C64MQG/B30 |
| MBM27C64-30Z | EPROM, 8KX8, 300ns, CMOS, CDIP28, | FUJITSU Limited | MBM27C64-30Z-X vs MBM27C64-30Z |
| M27C64A-30F1 | 8KX8 UVPROM, 300ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | MBM27C64-30Z-X vs M27C64A-30F1 |
| QD2764-3 | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | MBM27C64-30Z-X vs QD2764-3 |
| MBM2764-30Z | UVPROM, 8KX8, 300ns, NMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | MBM27C64-30Z-X vs MBM2764-30Z |