There are no models available for this part yet.
Overview of MBJCU168BB7223MTPA18 by TAIYO YUDEN
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 5 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for MBJCU168BB7223MTPA18 by TAIYO YUDEN
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
587-MBJCU168BB7223MTPA18TR-ND
|
DigiKey | CAP CER 0.022UF 50V X7R 0603 Min Qty: 3000 Lead time: 12 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
|
$0.0653 | Buy Now | |
|
DISTI #
MBJCU168BB7223MTPA
|
Avnet Americas | MLCC, 0603, 50V, X7R, 0.022UF 20%, T&R - Tape and Reel (Alt: MBJCU168BB7223MTPA) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Container: Reel | 0 |
|
$0.0510 / $0.0575 | Buy Now | |
|
DISTI #
963-MBJCU168BB7223MT
|
Mouser Electronics | Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 0.022uF X7R 0603 20% Industrial RoHS: Compliant | 0 |
|
$0.0430 / $0.2900 | Order Now | |
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 3000 Package Multiple: 3000 Lead time: 11 Weeks | 0 |
|
$0.0431 | Buy Now | ||
| Onlinecomponents.com | RoHS: Compliant | 0 |
|
$0.0473 / $0.0558 | Buy Now |
CAD Models for MBJCU168BB7223MTPA18 by TAIYO YUDEN
Part Data Attributes for MBJCU168BB7223MTPA18 by TAIYO YUDEN
|
|
|
|---|---|
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Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
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Ihs Manufacturer
|
TAIYO YUDEN CO LTD
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|
Package Description
|
CHIP
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Reach Compliance Code
|
unknown
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ECCN Code
|
EAR99
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HTS Code
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8532.24.00.20
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Capacitance
|
0.022 µF
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Capacitor Type
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CERAMIC CAPACITOR
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Dielectric Material
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CERAMIC
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Height
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0.8 mm
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Length
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1.6 mm
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Mounting Feature
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SURFACE MOUNT
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Multilayer
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Yes
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Negative Tolerance
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20%
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Number of Terminals
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2
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Package Shape
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RECTANGULAR PACKAGE
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Package Style
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SMT
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Packing Method
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TR, PAPER, 7 INCH
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Positive Tolerance
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20%
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Rated (DC) Voltage (URdc)
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50 V
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Size Code
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0603
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Surface Mount
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YES
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Temperature Characteristics Code
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X7R
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Temperature Coefficient
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15% ppm/°C
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Terminal Shape
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WRAPAROUND
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Width
|
0.8 mm
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Alternate Parts for MBJCU168BB7223MTPA18
This table gives cross-reference parts and alternative options found for MBJCU168BB7223MTPA18. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBJCU168BB7223MTPA18, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 0603B223M500NT | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | MBJCU168BB7223MTPA18 vs 0603B223M500NT |
| 0603Y0500223MER | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT | Syfer Technology | MBJCU168BB7223MTPA18 vs 0603Y0500223MER |
| 0603B223M500ST | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | MBJCU168BB7223MTPA18 vs 0603B223M500ST |
| 0603B223M500CT | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | MBJCU168BB7223MTPA18 vs 0603B223M500CT |
| 0603B223M500CR | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT | Walsin Technology Corporation | MBJCU168BB7223MTPA18 vs 0603B223M500CR |
| 0603B223M500NB | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP | Fenghua (HK) Electronics Ltd | MBJCU168BB7223MTPA18 vs 0603B223M500NB |
| MCJCU168BB7223MTPA01 | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP | TAIYO YUDEN | MBJCU168BB7223MTPA18 vs MCJCU168BB7223MTPA01 |
| MMJCU168BB7223MTPA18 | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP | TAIYO YUDEN | MBJCU168BB7223MTPA18 vs MMJCU168BB7223MTPA18 |
| B37931K5223M060 | CAPACITOR, CERAMIC, MULTILAYER, 50V, X7R, 0.022uF, SURFACE MOUNT, 0603, CHIP | TDK Epcos | MBJCU168BB7223MTPA18 vs B37931K5223M060 |
| B37931K5223M001 | CAPACITOR, CERAMIC, MULTILAYER, 50V, X7R, 0.022uF, SURFACE MOUNT, 0603, CHIP | TDK Epcos | MBJCU168BB7223MTPA18 vs B37931K5223M001 |