Part Details for MB90F927PF-GE1 by FUJITSU Limited
Overview of MB90F927PF-GE1 by FUJITSU Limited
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Part Details for MB90F927PF-GE1
MB90F927PF-GE1 CAD Models
MB90F927PF-GE1 Part Data Attributes
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MB90F927PF-GE1
FUJITSU Limited
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Datasheet
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MB90F927PF-GE1
FUJITSU Limited
Microcontroller, 16-Bit, FLASH, 16MHz, CMOS, PQFP100, 14 X 20 MM, 3.35 MM HEIGHT, 0.65 MM PITCH, PLASTIC, QFP-100
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Rohs Code | Yes | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | FUJITSU LTD | |
Package Description | QFP, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | NO | |
Address Bus Width | ||
Bit Size | 16 | |
Clock Frequency-Max | 16 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | R-PQFP-G100 | |
JESD-609 Code | e6 | |
Length | 20 mm | |
Number of I/O Lines | 70 | |
Number of Terminals | 100 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Qualification Status | Not Qualified | |
ROM Programmability | FLASH | |
Seated Height-Max | 3.35 mm | |
Speed | 16 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3.7 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN BISMUTH | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |