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Overview of MB810ACF by FUJITSU Semiconductor Limited
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
CAD Models for MB810ACF by FUJITSU Semiconductor Limited
Part Data Attributes for MB810ACF by FUJITSU Semiconductor Limited
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
FUJITSU LTD
|
Package Description
|
DFP, FL16,.3
|
Reach Compliance Code
|
compliant
|
HTS Code
|
8542.39.00.01
|
JESD-30 Code
|
R-XDFP-F16
|
JESD-609 Code
|
e0
|
Logic IC Type
|
OR/NOR GATE
|
Number of Functions
|
2
|
Number of Inputs
|
4
|
Number of Terminals
|
16
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Package Body Material
|
CERAMIC
|
Package Code
|
DFP
|
Package Equivalence Code
|
FL16,.3
|
Package Shape
|
RECTANGULAR
|
Package Style
|
FLATPACK
|
Power Supply Current-Max (ICC)
|
25 mA
|
Prop. Delay@Nom-Sup
|
0.65 ns
|
Propagation Delay (tpd)
|
0.65 ns
|
Qualification Status
|
Not Qualified
|
Schmitt Trigger
|
NO
|
Supply Voltage-Max (Vsup)
|
-5.46 V
|
Supply Voltage-Min (Vsup)
|
-4.94 V
|
Supply Voltage-Nom (Vsup)
|
-5.2 V
|
Surface Mount
|
YES
|
Technology
|
ECL
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
FLAT
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
DUAL
|