| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Analog Devices Inc | 12-Bit, 4.0Gsps High-Dynamic P Min Qty: 1 Package Multiple: 1 | 0 |
|
Buy Now |
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Active
|
|
Part Package Code
|
169-CSP_BGA-11X11X1
|
|
Pin Count
|
169
|
|
Manufacturer Package Code
|
169-CSP_BGA-11X11X1
|
|
Date Of Intro
|
2008-02-07
|
|
Samacsys Manufacturer
|
Analog Devices
|
|
Converter Type
|
D/A CONVERTER
|
|
Input Bit Code
|
OFFSET BINARY
|
|
Input Format
|
PARALLEL, WORD
|
|
JESD-30 Code
|
S-PBGA-B169
|
|
JESD-609 Code
|
e0
|
|
Length
|
11 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Bits
|
12
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
169
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LFBGA
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
240
|
|
Seated Height-Max
|
1.5 mm
|
|
Settling Time-Nom (tstl)
|
0.0045 µs
|
|
Supply Voltage-Nom
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
20
|
|
Width
|
11 mm
|
