Part Details for M93S66-DS3TP/W by STMicroelectronics
Overview of M93S66-DS3TP/W by STMicroelectronics
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Applications
Industrial Automation
Part Details for M93S66-DS3TP/W
M93S66-DS3TP/W CAD Models
M93S66-DS3TP/W Part Data Attributes
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M93S66-DS3TP/W
STMicroelectronics
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Datasheet
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M93S66-DS3TP/W
STMicroelectronics
IC,SERIAL EEPROM,256X16,CMOS,TSSOP,8PIN,PLASTIC
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Data Retention Time-Min | 40 | |
| Endurance | 1000000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Memory Density | 4096 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256X16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP8,.19 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | SERIAL | |
| Qualification Status | Not Qualified | |
| Serial Bus Type | MICROWIRE | |
| Standby Current-Max | 0.000015 A | |
| Supply Current-Max | 0.002 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Write Protection | HARDWARE/SOFTWARE |