There are no models available for this part yet.
Overview of M93C66-DS3TG/W by STMicroelectronics
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for M93C66-DS3TG/W by STMicroelectronics
Part Data Attributes for M93C66-DS3TG/W by STMicroelectronics
|
|
|
|---|---|
|
Pbfree Code
|
Yes
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|
Rohs Code
|
Yes
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|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
STMICROELECTRONICS
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|
Part Package Code
|
SOIC
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Package Description
|
3 X 3 MM, ROHS COMPLIANT, TSSOP-8
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Pin Count
|
8
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Reach Compliance Code
|
compliant
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ECCN Code
|
EAR99
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HTS Code
|
8542.32.00.51
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Alternate Memory Width
|
8
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Clock Frequency-Max (fCLK)
|
2 MHz
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Data Retention Time-Min
|
40
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Endurance
|
1000000 Write/Erase Cycles
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JESD-30 Code
|
S-PDSO-G8
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JESD-609 Code
|
e4
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Length
|
3 mm
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Memory Density
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4096 bit
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Memory IC Type
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EEPROM
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Memory Width
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16
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Moisture Sensitivity Level
|
1
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Number of Functions
|
1
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Number of Terminals
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8
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Number of Words
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256 words
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Number of Words Code
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256
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
|
125 °C
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Operating Temperature-Min
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-40 °C
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Organization
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256X16
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
TSSOP
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Package Equivalence Code
|
TSSOP8,.19
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Package Shape
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SQUARE
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Package Style
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SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
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Parallel/Serial
|
SERIAL
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Qualification Status
|
Not Qualified
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Seated Height-Max
|
1.1 mm
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Serial Bus Type
|
MICROWIRE
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Standby Current-Max
|
0.000015 A
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Supply Current-Max
|
0.002 mA
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Supply Voltage-Max (Vsup)
|
5.5 V
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Supply Voltage-Min (Vsup)
|
4.5 V
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|
Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
|
AUTOMOTIVE
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Terminal Finish
|
NICKEL PALLADIUM GOLD
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Terminal Form
|
GULL WING
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Terminal Pitch
|
0.65 mm
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Terminal Position
|
DUAL
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Width
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3 mm
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Write Cycle Time-Max (tWC)
|
5 ms
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Write Protection
|
SOFTWARE
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Alternate Parts for M93C66-DS3TG/W
This table gives cross-reference parts and alternative options found for M93C66-DS3TG/W. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M93C66-DS3TG/W, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M93C66-DS3P | 256X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3 X 3 MM, LEAD FREE, TSSOP-8 | STMicroelectronics | M93C66-DS3TG/W vs M93C66-DS3P |
| M93C66-DS7TG | 256X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3 X 3 MM, ROHS COMPLIANT, TSSOP-8 | STMicroelectronics | M93C66-DS3TG/W vs M93C66-DS7TG |
| M93C66-DS6T | 256X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3 X 3 MM, TSSOP-8 | STMicroelectronics | M93C66-DS3TG/W vs M93C66-DS6T |
| 93C66C-TE/MSG | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, LEAD FREE, PLASTIC, MO-187, MSOP-8 | Microchip Technology Inc | M93C66-DS3TG/W vs 93C66C-TE/MSG |
| M93C66-DS3T/W | 256X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3 X 3 MM, TSSOP-8 | STMicroelectronics | M93C66-DS3TG/W vs M93C66-DS3T/W |
| M93C66-DS3TP | 256X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3 X 3 MM, LEAD FREE, TSSOP-8 | STMicroelectronics | M93C66-DS3TG/W vs M93C66-DS3TP |
| 93C66C-TI/MSG | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, LEAD FREE, PLASTIC, MO-187, MSOP-8 | Microchip Technology Inc | M93C66-DS3TG/W vs 93C66C-TI/MSG |
| M93C66-DS3G/S | 256X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3 X 3 MM, ROHS COMPLIANT, TSSOP-8 | STMicroelectronics | M93C66-DS3TG/W vs M93C66-DS3G/S |
| M93C66-DS3/S | 256X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3 X 3 MM, TSSOP-8 | STMicroelectronics | M93C66-DS3TG/W vs M93C66-DS3/S |
| M93C66-DS3 | 256X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3 X 3 MM, TSSOP-8 | STMicroelectronics | M93C66-DS3TG/W vs M93C66-DS3 |