Part Details for M58WR064KT70ZAQ6F by Micron Technology Inc
Overview of M58WR064KT70ZAQ6F by Micron Technology Inc
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Part Details for M58WR064KT70ZAQ6F
M58WR064KT70ZAQ6F CAD Models
M58WR064KT70ZAQ6F Part Data Attributes
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M58WR064KT70ZAQ6F
Micron Technology Inc
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Datasheet
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M58WR064KT70ZAQ6F
Micron Technology Inc
Flash, 4MX16, 70ns, PBGA88
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | FBGA, BGA88,8X12,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 70 ns | |
| Boot Block | TOP | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | NO | |
| JESD-30 Code | R-PBGA-B88 | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Sectors/Size | 8,127 | |
| Number of Terminals | 88 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA88,8X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Page Size | 4 words | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Sector Size | 4K,32K | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.07 mA | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Toggle Bit | NO | |
| Type | NOR TYPE |