M38510/23115BWB by: Texas Instruments

256X4 STANDARD SRAM, 55ns, DIP22, 0.375 X 0.875 INCH, DIP-22

Part Details for M38510/23115BWB by Texas Instruments

Overview of M38510/23115BWB by Texas Instruments

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Applications Consumer Electronics Environmental Monitoring Smart Cities

Part Details for M38510/23115BWB

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M38510/23115BWB Part Data Attributes:

M38510/23115BWB Texas Instruments
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M38510/23115BWB Texas Instruments 256X4 STANDARD SRAM, 55ns, DIP22, 0.375 X 0.875 INCH, DIP-22
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description DIP,
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 55 ns
JESD-30 Code R-XDIP-T22
Memory Density 1024 bit
Memory IC Type STANDARD SRAM
Memory Width 4
Number of Functions 1
Number of Terminals 22
Number of Words 256 words
Number of Words Code 256
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 256X4
Package Body Material UNSPECIFIED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology TTL
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for M38510/23115BWB

This table gives cross-reference parts and alternative options found for M38510/23115BWB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/23115BWB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
93L422ADCQR 256X4 CACHE SRAM, 25ns, CDIP22, CERAMIC, DIP-22 Texas Instruments M38510/23115BWB vs 93L422ADCQR
M38510/23115BWX Standard SRAM, 256X4, 55ns, TTL, 0.375 X 0.875 INCH, DIP-22 SRI International Sarnoff M38510/23115BWB vs M38510/23115BWX
M38510/23115BWC Standard SRAM, 256X4, 55ns, TTL, 0.375 X 0.875 INCH, DIP-22 SRI International Sarnoff M38510/23115BWB vs M38510/23115BWC
93L422ADM Cache SRAM, 256X4, 55ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22 Fairchild Semiconductor Corporation M38510/23115BWB vs 93L422ADM
M38510/23115BWA Standard SRAM, 256X4, 55ns, TTL, 0.375 X 0.875 INCH, DIP-22 SRI International Sarnoff M38510/23115BWB vs M38510/23115BWA
Part Number Description Manufacturer Compare
P4C422-25PC Standard SRAM, 256X4, 25ns, CMOS, PDIP22, 0.400 INCH, PLASTIC, DIP-22 Pyramid Semiconductor Corporation M38510/23115BWB vs P4C422-25PC
AM91L01ADM Standard SRAM, 256X4, 500ns, NMOS, CDIP22, HERMETIC SEALED, SIDE BRAZED, DIP-22 AMD M38510/23115BWB vs AM91L01ADM
P4C422-12PI Standard SRAM, 256X4, 12ns, CMOS, PDIP22, PLASTIC, DIP-22 Pyramid Semiconductor Corporation M38510/23115BWB vs P4C422-12PI
P4C422-25CC Standard SRAM, 256X4, 25ns, CMOS, CDIP22, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-22 Pyramid Semiconductor Corporation M38510/23115BWB vs P4C422-25CC
P4C422-15PMB Standard SRAM, 256X4, 15ns, CMOS, PDIP22, 0.400 INCH, PLASTIC, DIP-22 Pyramid Semiconductor Corporation M38510/23115BWB vs P4C422-15PMB
93L422APC 256X4 CACHE SRAM, 25ns, PDIP22, PLASTIC, DIP-22 Texas Instruments M38510/23115BWB vs 93L422APC
P4C422-35PM Standard SRAM, 256X4, 35ns, CMOS, PDIP22, 0.400 INCH, PLASTIC, DIP-22 Pyramid Semiconductor Corporation M38510/23115BWB vs P4C422-35PM
AM93422APC Standard SRAM, 256X4, 35ns, TTL, PDIP22, PLASTIC, DIP-22 AMD M38510/23115BWB vs AM93422APC
AM9101CDMB Standard SRAM, 256X4, 300ns, NMOS, CDIP22, HERMETIC SEALED, SIDE BRAZED, DIP-22 AMD M38510/23115BWB vs AM9101CDMB
VS12G422TDC-6 Cache SRAM, 256X4, 6ns, MOS, CDIP22, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-22 Vitesse Semiconductor Corporation M38510/23115BWB vs VS12G422TDC-6

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