Part Details for M364C0804BT0-C50 by Samsung Semiconductor
Overview of M364C0804BT0-C50 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for M364C0804BT0-C50
M364C0804BT0-C50 CAD Models
M364C0804BT0-C50 Part Data Attributes:
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M364C0804BT0-C50
Samsung Semiconductor
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Datasheet
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M364C0804BT0-C50
Samsung Semiconductor
Fast Page DRAM Module, 8MX64, 50ns, CMOS, DIMM-168
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | DIMM | |
Package Description | DIMM, DIMM168 | |
Pin Count | 168 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.28 | |
Access Mode | FAST PAGE | |
Access Time-Max | 50 ns | |
Additional Feature | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | |
I/O Type | COMMON | |
JESD-30 Code | R-XDMA-N168 | |
Memory Density | 536870912 bit | |
Memory IC Type | FAST PAGE DRAM MODULE | |
Memory Width | 64 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 168 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8MX64 | |
Output Characteristics | 3-STATE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIMM | |
Package Equivalence Code | DIMM168 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Qualification Status | Not Qualified | |
Refresh Cycles | 4096 | |
Standby Current-Max | 0.03 A | |
Supply Current-Max | 0.58 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL |
Alternate Parts for M364C0804BT0-C50
This table gives cross-reference parts and alternative options found for M364C0804BT0-C50. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M364C0804BT0-C50, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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KMM366S823DTF-G0 | Synchronous DRAM Module, 8MX64, 7ns, CMOS, DIMM-168 | Samsung Semiconductor | M364C0804BT0-C50 vs KMM366S823DTF-G0 |
MC-458CB646PFB-A80 | Synchronous DRAM Module, 8MX64, 6ns, MOS, SOCKET TYPE, DIMM-168 | Elpida Memory Inc | M364C0804BT0-C50 vs MC-458CB646PFB-A80 |
KMM364C803CS-5 | Fast Page DRAM Module, 8MX64, 50ns, CMOS | Samsung Semiconductor | M364C0804BT0-C50 vs KMM364C803CS-5 |
HB52E88EM-B6D | Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-168 | Hitachi Ltd | M364C0804BT0-C50 vs HB52E88EM-B6D |
HYM71V8655HCT6-8 | Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-168 | SK Hynix Inc | M364C0804BT0-C50 vs HYM71V8655HCT6-8 |
M364C0883CJ0-C60 | Fast Page DRAM Module, 8MX64, 60ns, CMOS, DIMM-168 | Samsung Semiconductor | M364C0804BT0-C50 vs M364C0883CJ0-C60 |
HYM72V16656BLT6-P | Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-168 | SK Hynix Inc | M364C0804BT0-C50 vs HYM72V16656BLT6-P |
HYM76V8635HGT8-K | Synchronous DRAM Module, 8MX64, 5.4ns, CMOS, DIMM-168 | SK Hynix Inc | M364C0804BT0-C50 vs HYM76V8635HGT8-K |
HB56S864ESN-8B | EDO DRAM Module, 8MX64, 80ns, MOS, DIMM-168 | Hitachi Ltd | M364C0804BT0-C50 vs HB56S864ESN-8B |
HYM7V64830TFG-10 | Synchronous DRAM Module, 8MX64, 8ns, CMOS, DIMM-168 | SK Hynix Inc | M364C0804BT0-C50 vs HYM7V64830TFG-10 |