Datasheets
M312L3223HUS-CB0 by: Samsung Semiconductor

DDR DRAM Module, 32MX72, 0.75ns, CMOS, ROHS COMPLIANT, DIMM-184

Part Details for M312L3223HUS-CB0 by Samsung Semiconductor

Overview of M312L3223HUS-CB0 by Samsung Semiconductor

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Applications Consumer Electronics Computing and Data Storage Renewable Energy

Part Details for M312L3223HUS-CB0

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M312L3223HUS-CB0 Part Data Attributes

M312L3223HUS-CB0 Samsung Semiconductor
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M312L3223HUS-CB0 Samsung Semiconductor DDR DRAM Module, 32MX72, 0.75ns, CMOS, ROHS COMPLIANT, DIMM-184
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code DIMM
Package Description DIMM, DIMM184
Pin Count 184
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST
Access Time-Max 0.75 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
JESD-30 Code R-XDMA-N184
Memory Density 2415919104 bit
Memory IC Type DDR DRAM MODULE
Memory Width 72
Number of Functions 1
Number of Ports 1
Number of Terminals 184
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX72
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED
Package Code DIMM
Package Equivalence Code DIMM184
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Refresh Cycles 8192
Self Refresh YES
Standby Current-Max 0.33 A
Supply Current-Max 2.75 mA
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Alternate Parts for M312L3223HUS-CB0

This table gives cross-reference parts and alternative options found for M312L3223HUS-CB0. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M312L3223HUS-CB0, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HYMD232G726D8M-H DDR DRAM Module, 32MX8, 0.75ns, CMOS, DIMM-184 SK Hynix Inc M312L3223HUS-CB0 vs HYMD232G726D8M-H
M312L3223BT0-LB0 DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor M312L3223HUS-CB0 vs M312L3223BT0-LB0
M312L3223BT0-LA2 DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor M312L3223HUS-CB0 vs M312L3223BT0-LA2
M383L3223BT1-CB0 DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor M312L3223HUS-CB0 vs M383L3223BT1-CB0
M383L3223DTS-LA2 DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor M312L3223HUS-CB0 vs M383L3223DTS-LA2
M312L3223ETS-CAA DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor M312L3223HUS-CB0 vs M312L3223ETS-CAA
M312L3223ETS-CB0 DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor M312L3223HUS-CB0 vs M312L3223ETS-CB0
NT256D72S89B0GU-75B DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 Nanya Technology Corporation M312L3223HUS-CB0 vs NT256D72S89B0GU-75B
M312L3223DG0-CB0 DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor M312L3223HUS-CB0 vs M312L3223DG0-CB0
HYMD232G726DP8M-H DDR DRAM Module, 32MX8, 0.75ns, CMOS, ROHS COMPLIANT, DIMM-184 SK Hynix Inc M312L3223HUS-CB0 vs HYMD232G726DP8M-H
Part Number Description Manufacturer Compare
HYMD216726C6-M DDR DRAM Module, 16MX72, 0.75ns, CMOS, SODIMM-184 SK Hynix Inc M312L3223HUS-CB0 vs HYMD216726C6-M
MT18VDDT3272DY-262XX DDR DRAM Module, 32MX72, 0.75ns, CMOS, LEAD FREE, DIMM-184 Micron Technology Inc M312L3223HUS-CB0 vs MT18VDDT3272DY-262XX
HYS72D32500HR-8-A DDR DRAM Module, 32MX72, 0.8ns, CMOS, DIMM-184 Infineon Technologies AG M312L3223HUS-CB0 vs HYS72D32500HR-8-A
HYMD132G725A8-K DDR DRAM Module, 32MX72, 0.75ns, CMOS, 5.250 X 1.700 X 0.150 INCH, DIMM-184 SK Hynix Inc M312L3223HUS-CB0 vs HYMD132G725A8-K
HYMD132G725B8-L DDR DRAM Module, 32MX72, 0.8ns, CMOS, 5.250 X 1.700 X 0.150 INCH, DIMM-184 SK Hynix Inc M312L3223HUS-CB0 vs HYMD132G725B8-L
HYMD116725A8-H DDR DRAM Module, 16MX72, 0.75ns, CMOS, 5.250 X 1.250 X 0.150 INCH, DIMM-184 SK Hynix Inc M312L3223HUS-CB0 vs HYMD116725A8-H
MT5VDDT3272AY-26AXX DDR DRAM Module, 32MX72, 0.75ns, CMOS, LEAD FREE, DIMM-184 Micron Technology Inc M312L3223HUS-CB0 vs MT5VDDT3272AY-26AXX
M381L1713ETM-LB3 DDR DRAM Module, 16MX72, 0.7ns, CMOS, DIMM-184 Samsung Semiconductor M312L3223HUS-CB0 vs M381L1713ETM-LB3
M312L3313CT0-CB0 DDR DRAM Module, 32MX72, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor M312L3223HUS-CB0 vs M312L3313CT0-CB0
V827432K24SCIW-D3 DDR DRAM Module, 32MX72, 0.65ns, CMOS, GREEN, DIMM-184 ProMOS Technologies Inc M312L3223HUS-CB0 vs V827432K24SCIW-D3

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