Memory
M312L2923BG0-CB3
Samsung Semiconductor
Description: DDR DRAM Module, 128MX72, 0.7ns, CMOS, DIMM-184

Overview of M312L2923BG0-CB3 by Samsung Semiconductor

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Consumer Electronics Computing and Data Storage

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Part Data Attributes for M312L2923BG0-CB3 by Samsung Semiconductor

M312L2923BG0-CB3
Samsung Semiconductor
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIMM
Package Description
DIMM, DIMM184
Pin Count
184
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.36
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
0.7 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
166 MHz
I/O Type
COMMON
JESD-30 Code
R-XDMA-N184
Memory Density
9663676416 bit
Memory IC Type
DDR DRAM MODULE
Memory Width
72
Moisture Sensitivity Level
1
Number of Functions
1
Number of Ports
1
Number of Terminals
184
Number of Words
134217728 words
Number of Words Code
128000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
128MX72
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
Package Code
DIMM
Package Equivalence Code
DIMM184
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Refresh Cycles
8192
Self Refresh
YES
Supply Current-Max
4.93 mA
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
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  1. M312L2923BG0-CB3
    Samsung Semiconductor
    DDR DRAM Module, 128MX72, 0.7ns, CMOS, DIMM-184
    VS

Alternate Parts for M312L2923BG0-CB3

This table gives cross-reference parts and alternative options found for M312L2923BG0-CB3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M312L2923BG0-CB3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
M312L2828CT0-LB3 DDR DRAM Module, 128MX72, 0.7ns, CMOS, DIMM-184 Samsung Semiconductor M312L2923BG0-CB3 vs M312L2828CT0-LB3
EBD11RD8ADFA-6B DDR DRAM Module, 128MX72, 0.7ns, CMOS, DIMM-184 Elpida Memory Inc M312L2923BG0-CB3 vs EBD11RD8ADFA-6B
M312L2923CUS-CB3 DDR DRAM Module, 128MX72, 0.7ns, CMOS, DIMM-184 Samsung Semiconductor M312L2923BG0-CB3 vs M312L2923CUS-CB3
M312L2820EG0-CB3 DDR DRAM Module, 128MX72, 0.7ns, CMOS, DIMM-184 Samsung Semiconductor M312L2923BG0-CB3 vs M312L2820EG0-CB3
M312L2828CT0-CB3 DDR DRAM Module, 128MX72, 0.7ns, CMOS, DIMM-184 Samsung Semiconductor M312L2923BG0-CB3 vs M312L2828CT0-CB3
M312L2820EZ0-CB3 DDR DRAM Module, 128MX72, 0.7ns, CMOS, ROHS COMPLIANT, DIMM-184 Samsung Semiconductor M312L2923BG0-CB3 vs M312L2820EZ0-CB3
HYS72D128320GBR-6-C DDR DRAM Module, 128MX72, 0.7ns, CMOS, DIMM-184 Qimonda AG M312L2923BG0-CB3 vs HYS72D128320GBR-6-C
HYMD212G726DFP4-J DDR DRAM Module, 64MX4, 0.7ns, CMOS, ROHS COMPLIANT, DIMM-184 SK Hynix Inc M312L2923BG0-CB3 vs HYMD212G726DFP4-J
HYS72D128320HBR-6-C DDR DRAM Module, 128MX72, 0.7ns, CMOS, GREEN, DIMM-184 Qimonda AG M312L2923BG0-CB3 vs HYS72D128320HBR-6-C
HYS72D128320GBR-6-B DDR DRAM Module, 128MX72, 0.7ns, CMOS, DIMM-184 Infineon Technologies AG M312L2923BG0-CB3 vs HYS72D128320GBR-6-B
Part Number Description Manufacturer Compare
HYMD512G726BFP4N-J DDR DRAM Module, 128MX72, 0.7ns, CMOS, ROHS COMPLIANT, DIMM-184 SK Hynix Inc M312L2923BG0-CB3 vs HYMD512G726BFP4N-J
M383L2828EU1-CA0 DDR DRAM Module, 128MX72, 0.8ns, CMOS, DIMM-184 Samsung Semiconductor M312L2923BG0-CB3 vs M383L2828EU1-CA0
MT18VDVF12872DG-265XX DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184 Micron Technology Inc M312L2923BG0-CB3 vs MT18VDVF12872DG-265XX
M312L2920BG0-CA2 DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor M312L2923BG0-CB3 vs M312L2920BG0-CA2
VR4CU287228EBP DDR DRAM Module, 128MX72, 0.65ns, CMOS, ROHS COMPLIANT, DIMM-184 Viking Technology M312L2923BG0-CB3 vs VR4CU287228EBP
W3EG264M72AFSR265D3MG DDR DRAM Module, 128MX72, 0.75ns, CMOS, ROHS COMPLIANT, DIMM-184 Microsemi Corporation M312L2923BG0-CB3 vs W3EG264M72AFSR265D3MG
MT18VDVF12872DG-262XX DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184 Micron Technology Inc M312L2923BG0-CB3 vs MT18VDVF12872DG-262XX
M383L2920BUS-CA0 DDR DRAM Module, 128MX72, 0.8ns, CMOS, DIMM-184 Samsung Semiconductor M312L2923BG0-CB3 vs M383L2920BUS-CA0
M383L2828DT1-LB0 DDR DRAM Module, 128MX72, 0.75ns, CMOS, DIMM-184 Samsung Semiconductor M312L2923BG0-CB3 vs M383L2828DT1-LB0
MT18VDDT12872LAIY-202XX DDR DRAM Module, 128MX72, 0.8ns, CMOS, MO-206, DIMM-184 Micron Technology Inc M312L2923BG0-CB3 vs MT18VDDT12872LAIY-202XX

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